AFS600-FG256I
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA |
|---|---|
| Quantity | 645 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 119 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of AFS600-FG256I – Fusion® Field Programmable Gate Array (FPGA) IC 119 110592 256-LBGA
The AFS600-FG256I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology provided in a 256-LBGA package. It delivers a mid-range programmable logic resource set including 13,824 logic elements, approximately 0.11 Mbits of embedded RAM, and 119 general-purpose I/Os for flexible system integration.
Designed for industrial-grade applications, the device supports a supply voltage window of 1.425 V to 1.575 V and an operating temperature range of -40 °C to 100 °C. The device is RoHS compliant and supplied in a surface-mount 256-FPBGA (17×17) footprint.
Key Features
- Core / Logic 13,824 logic elements and 600,000 gates provide the programmable logic capacity required for custom digital functions and moderate-complexity designs.
- Embedded Memory Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for data buffering, lookup tables, and state storage.
- I/O Resources 119 I/O pins to support a range of peripheral interfaces and board-level connectivity requirements.
- Power Nominal supply voltage range of 1.425 V to 1.575 V to match system power rails.
- Package & Mounting Surface-mount 256-LBGA (supplier device package: 256-FPBGA, 17×17) for compact, high-density PCB implementations.
- Temperature & Grade Industrial-grade device rated for operation from -40 °C to 100 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- Substantial programmable logic: 13,824 logic elements and 600,000 gates deliver the gate count needed for consolidated digital subsystems.
- On-chip memory for local buffering: Approximately 0.11 Mbits of embedded RAM reduces reliance on external memory for small- to mid-sized data storage tasks.
- Ample I/O capacity: 119 I/Os enable flexible interfacing with sensors, peripherals, and other system components.
- Industrial operating range: -40 °C to 100 °C rating supports deployment in demanding temperature environments.
- Compact, surface-mount footprint: 256-LBGA / 256-FPBGA (17×17) package supports high-density board layouts.
- Regulatory friendliness: RoHS compliance simplifies integration into environmentally conscious product lines.
Why Choose AFS600-FG256I?
The AFS600-FG256I positions itself as an industrial-grade Fusion® FPGA option that balances logic capacity, embedded memory, and I/O count in a compact 256-LBGA package. Its electrical and thermal ratings make it suitable for embedded designs that require moderate programmable logic, on-chip RAM, and robust environmental tolerance.
For design teams targeting compact, surface-mount implementations with clear supply-voltage and temperature requirements, the AFS600-FG256I offers verifiable specifications and RoHS compliance to support procurement and deployment decisions.
Request a quote or submit a pricing inquiry to evaluate the AFS600-FG256I for your next design.
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