AFS600-FG484

The AFS600-FG484 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial applications. It delivers sizable programmable logic capacity with 600,000 gates and 13,824 logic elements, combined with on-chip RAM and a substantial I/O count for system integration.

Its combination of logic resources, approximately 110,592 bits of embedded memory, 172 general-purpose I/Os and a 484-FPBGA (23×23) package makes it suitable for commercial embedded designs that require flexible, board-level programmable logic within a defined supply and temperature envelope.

Key Features

• Logic Capacity — 600,000 gates and 13,824 logic elements provide significant programmable resource density for implementing custom logic and control functions.
• Embedded Memory — Approximately 110,592 bits (~0.11 Mbits) of on-chip RAM for buffering, FIFOs or small on-chip data storage needs.
• I/O Resources — 172 I/O pins to support a wide range of external interfaces, sensors, and peripherals on a single device.
• Package and Mounting — 484-FPBGA (23×23) package case in a 484-BGA footprint; surface-mount mounting type suitable for modern PCB assembly.
• Power — Operates from a core supply range of 1.425 V to 1.575 V for predictable power planning.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation to meet standard commercial environmental requirements.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Commercial Embedded Systems — Use the AFS600-FG484 where on-board programmable logic, moderate embedded memory and a high I/O count are required for custom control or data processing.
• Board-Level Prototyping — Implement and validate custom logic functions and peripheral interfaces in a compact 484-FPBGA package for commercial products.
• I/O-Intensive Control — Suitable for control systems that require many discrete or parallel I/O connections supported by 172 I/O pins.

Unique Advantages

• High Logic Density: 600,000 gates and 13,824 logic elements enable substantial on-chip implementation of custom logic without adding external ASICs or CPLDs.
• Integrated On-Chip Memory: Approximately 110,592 bits of embedded RAM reduce the need for external buffering components, simplifying board design.
• Extensive I/O Count: 172 I/Os provide flexibility to connect multiple peripherals, sensors, and interfaces directly to the FPGA.
• Compact BGA Package: 484-FPBGA (23×23) delivers a high pin count in a compact footprint for space-constrained commercial PCBs and surface-mount assembly.
• Defined Power and Thermal Envelope: Narrow supply range (1.425 V–1.575 V) and commercial temperature rating allow predictable power budgeting and thermal planning for commercial products.
• Regulatory Readiness: RoHS compliance supports environmental requirements for commercial electronics manufacturing.

Why Choose AFS600-FG484?

The AFS600-FG484 positions itself as a robust commercial FPGA option by combining substantial programmable logic, embedded RAM, and a high I/O count in a 484-FPBGA surface-mount package. It is well suited to designers who need on-board programmable resources for commercial embedded systems, board-level prototyping, or I/O-dense control applications.

Backed by Microchip Technology, this Fusion® FPGA provides a clear specification set—logic elements, on-chip memory, supply range, and temperature rating—that helps teams plan integration, BOMs, and thermal/power budgets with confidence for commercial product lines.

Request a quote or submit an inquiry to obtain pricing and availability for the AFS600-FG484 Fusion® FPGA. Our sales team can assist with lead times and ordering options to support your design schedule.