AFS600-FGG256I

The AFS600-FGG256I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade embedded logic and I/O integration. It combines a mid-range logic capacity and on-chip memory with a compact BGA package suitable for space-constrained surface-mount designs.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 119 user I/O, this device targets applications that require moderate gate density, flexible interfacing, and operation across a wide industrial temperature range while operating from a 1.425 V to 1.575 V supply.

Key Features

• Core Logic — 13,824 logic elements (cells) providing a total of 600,000 gates for implementing combinational and sequential logic functions.
• Embedded Memory — Approximately 0.11 Mbits (110,592 bits) of on-chip RAM to support buffering, state storage, and small data structures.
• I/O Capacity — 119 user I/O pins to support multiple interfaces and signal connections in compact systems.
• Power — Single supply operation with a defined range of 1.425 V to 1.575 V for deterministic power budgeting and design integration.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) optimized for surface-mount assembly in compact board layouts.
• Temperature & Grade — Industrial grade operation over −40°C to 100°C for reliable performance in demanding environments.
• Environmental Compliance — RoHS compliant to meet standard environmental and manufacturing requirements.

Unique Advantages

• Balanced Logic and Memory Capacity: 13,824 logic elements combined with 110,592 bits of RAM enable implementation of moderate-complexity designs without external memory for many control and glue-logic functions.
• Ample I/O in a Compact Footprint: 119 I/O pins delivered in a 256-LBGA package give designers flexibility to route multiple interfaces while keeping board area low.
• Industrial Temperature Range: Rated for −40°C to 100°C operation to support applications that require extended temperature tolerance.
• Defined Supply Window: Narrow 1.425 V to 1.575 V supply range simplifies power-supply selection and helps ensure predictable device behavior.
• Surface-Mount Ready: 256-FPBGA (17×17) package designed for standard surface-mount assembly processes to fit modern SMT manufacturing flows.
• Regulatory Ready: RoHS compliance for alignment with common environmental and manufacturing standards.

Why Choose AFS600-FGG256I?

The AFS600-FGG256I positions itself as a practical mid-density FPGA for industrial applications that require a careful balance of logic capacity, embedded memory, and I/O count in a compact surface-mount package. Its defined supply range and industrial temperature rating make it suitable for designs where predictable electrical performance and extended-temperature operation are required.

Backed by Microchip Technology, the AFS600-FGG256I is suited for engineers and procurement teams building robust, space-efficient systems that need on-chip logic, moderate embedded RAM, and flexible interfacing while meeting common environmental compliance requirements.

Request a quote or contact sales to discuss pricing, lead times, and volume availability for the AFS600-FGG256I.