AFS600-FGG484K

The AFS600-FGG484K is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology built for designs that require a military-grade device with substantial logic and I/O capacity. It provides 13,824 logic elements and approximately 0.11 Mbits of embedded memory within a compact 484-ball BGA package.

Designed for applications needing broad operating range and high I/O count, this FPGA combines mid-range gate density with a rugged operating temperature span and a tight supply-voltage window for predictable system integration.

Key Features

• Core Logic  13,824 logic elements (13824) and 600,000 gates provide mid-range programmable logic capacity for glue logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 0.11 Mbits (110,592 total RAM bits) of on-chip RAM for buffering, small lookup tables, and local data storage.
• High-Density I/O  172 user I/O pins support complex interfacing and multiple peripheral connections in a single device.
• Package & Mounting  484-FPBGA (23×23) package, 484-ball BGA footprint, designed for surface-mount assembly.
• Power  Narrow supply-voltage range of 1.425 V to 1.575 V for core operation, enabling consistent power budgeting and margining.
• Temperature & Grade  Military grade with an operating temperature range of –55 °C to 100 °C for deployment in demanding thermal environments.
• Compliance  RoHS compliant, meeting common environmental and material directives for electronic components.

Typical Applications

• Military and Aerospace Systems  Suitable where military-grade temperature range and reliability are required for control, processing, or interface functions.
• High-Density I/O Control  Applications that need many external connections—such as sensor farms, protocol bridging, or subsystem aggregation—benefit from 172 I/O pins.
• Embedded Processing and Glue Logic  Mid-range logic capacity and on-chip RAM make the device well suited for custom state machines, data routing, and peripheral management.
• Ruggedized Instrumentation  Devices operating across wide temperature ranges can use this FPGA for signal conditioning, timing, and control tasks.

Unique Advantages

• Military-Grade Temperature Range: Rated from –55 °C to 100 °C, enabling reliable operation in harsh thermal environments.
• Balanced Logic and Memory: 13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM offers a compact, integrated platform for moderate-complexity designs.
• High I/O Count: 172 I/O pins reduce the need for external multiplexers or additional interface ICs, simplifying board-level design.
• Compact BGA Packaging: 484-FPBGA (23×23) provides a dense footprint for space-constrained systems while supporting surface-mount assembly.
• Tight Core Voltage Window: The specified 1.425 V–1.575 V supply range allows predictable power management and easier margin planning.
• Regulatory Compliance: RoHS compliance supports environmentally conscious designs and procurement requirements.

Why Choose AFS600-FGG484K?

The AFS600-FGG484K positions itself as a mid-density, military-grade FPGA that combines 13,824 logic elements, 600,000 gates, and 172 I/O in a 484-ball BGA package. Its combination of logic, embedded memory, and a wide operating-temperature range makes it suitable for engineers building ruggedized control, interface, and processing subsystems.

Backed by Microchip Technology, this part is aimed at designs that require predictable power characteristics, compact packaging, and compliance with RoHS. It is a practical choice for customers seeking a scalable, reliable FPGA solution for demanding thermal and environmental conditions.

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