AFS600-FGG484I

The AFS600-FGG484I is a Fusion® FPGA IC delivering programmable logic and I/O capability in a 484-ball BGA package. It provides 13,824 logic elements (LEs) and approximately 0.11 Mbits of embedded memory, making it suitable for designs that require mid-range gate density and flexible I/O integration. With an industrial-grade temperature range and a tight core supply window, the device targets applications that require robust operation across temperature and reliable power characteristics.

Key Features

• Core Capacity  600,000 logic gates implemented across 13,824 logic elements for implementing custom logic, state machines, and glue logic.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM to support buffers, small FIFOs, and distributed storage without external memory.
• I/O  172 general-purpose I/O pins to support a wide range of external interfaces and board-level connectivity.
• Package  484-ball FPBGA (23 × 23) surface-mount package (484-BGA) for compact board integration and high pin count routing.
• Power  Core supply voltage range of 1.425 V to 1.575 V for predictable power planning and stable operation.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant construction to meet environmental and manufacturing requirements.

Typical Applications

• Industrial control and automation  Use the device’s 13,824 logic elements and 172 I/O to implement custom control, sensor aggregation, and protocol bridging in industrial equipment.
• Embedded system glue logic  Integrate peripheral interfacing, timing control, and custom state machines to reduce BOM and simplify system architecture.
• Communication and I/O expansion  Leverage plentiful I/O and on-chip memory for protocol adaptation, buffering, and parallel interface handling on compact PCBs.

Unique Advantages

• Balanced logic and memory mix: 13,824 logic elements combined with 110,592 bits of RAM provide a practical balance for mid-density custom logic and buffering needs.
• High I/O count in a compact package: 172 I/O in a 484-FPBGA (23 × 23) package enables extensive external connectivity while preserving board area.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Tight core supply window: Defined 1.425 V–1.575 V supply requirement aids in predictable power budgeting and supply design.
• Surface-mount, RoHS-compliant package: Surface-mount 484-BGA construction and RoHS compliance simplify modern assembly and environmental compliance efforts.

Why Choose AFS600-FGG484I?

The AFS600-FGG484I positions itself as a mid-density Fusion FPGA offering a concrete combination of logic capacity, embedded memory, and extensive I/O in a compact 484-BGA footprint. Its industrial temperature rating and defined power envelope make it well suited for engineers building reliable embedded and control systems that need programmable logic without sacrificing board area or I/O capability.

This device is appropriate for design teams that require a scalable, on-board programmable fabric with clear electrical and thermal specifications, enabling predictable integration and long-term deployment in industrial environments.

Request a quote or submit an inquiry to receive pricing and availability for the AFS600-FGG484I and to discuss how it can meet your project requirements.