AFS600-FGG484

The AFS600-FGG484 is a Fusion® Field Programmable Gate Array (FPGA) IC configured in a 484-ball BGA package. It provides a programmable fabric with 13,824 logic elements and approximately 600,000 gates, combined with on-chip RAM and a broad I/O count for compact system integration.

Designed for commercial-temperature embedded designs, this FPGA targets applications that require a balance of logic density, I/O connectivity and a compact surface-mount BGA footprint while operating from a low-voltage core supply.

Key Features

• Core Capacity  Approximately 600,000 gates organized as 13,824 logic elements, enabling substantive custom logic implementations within a single device.
• Embedded Memory  Approximately 110,592 bits (≈0.11 Mbits) of on-chip RAM to support small data buffers, state machines, and local storage.
• I/O Richness  172 programmable I/O pins provide flexible external connectivity for peripherals, interfaces and board-level routing.
• Power and Voltage  Core supply voltage range of 1.425 V to 1.575 V, suitable for low-voltage digital domains and predictable power provisioning.
• Package & Mounting  484-ball FPBGA (23 × 23) package in a 484-BGA case, optimized for surface-mount assembly in space-constrained boards.
• Temperature & Grade  Commercial grade operation rated from 0 °C to 85 °C for standard embedded and consumer applications.
• Compliance  RoHS compliant for lead-free assembly and regulatory alignment in commercial products.

Typical Applications

• Custom Logic Integration  Implement complex, application-specific processing and control logic using 13,824 logic elements and substantial gate count.
• High-Density I/O Interfacing  Use the 172 I/Os to connect multiple peripherals, sensors and interfaces within a single FPGA footprint.
• Embedded Memory Usage  Leverage approximately 110,592 bits of on-chip RAM for local buffering, lookup tables and small data storage needs.

Unique Advantages

• High logic density: 600,000 gates and 13,824 logic elements let designers consolidate multiple functions into one device, reducing board complexity.
• Compact BGA footprint: The 484-FPBGA (23×23) package enables high-density board layouts and surface-mount assembly for space-constrained systems.
• Broad I/O support: 172 I/O pins provide flexibility to interface with a wide range of external components and subsystems without additional glue logic.
• Low-voltage core operation: 1.425–1.575 V supply range aligns with modern low-voltage digital domains for predictable system power design.
• Commercial temperature suitability: Rated 0 °C to 85 °C to meet the needs of standard embedded and consumer applications.
• RoHS compliance: Supports lead-free manufacturing requirements for commercial products.

Why Choose AFS600-FGG484?

The AFS600-FGG484 delivers a balance of logic capacity, on-chip memory and flexible I/O in a compact 484-BGA surface-mount package, making it a practical choice for embedded designs that require substantial programmable logic without excessive board area. Its low-voltage core and commercial temperature rating make it suitable for a wide range of standard electronic products.

Ideal for designers needing to consolidate discrete logic and interface functions into a single programmable device, the AFS600-FGG484 offers predictable operating parameters and compliance for commercial production, supporting streamlined BOMs and simplified board layouts.

Request a quote or contact sales to discuss availability, lead times and pricing for the AFS600-FGG484 Fusion FPGA.