AFS600-FGG256K

The AFS600-FGG256K is a Fusion® field-programmable gate array from Microchip Technology designed for applications that require reconfigurable logic with military-grade environmental tolerance. It integrates 600,000 gates and 13,824 logic elements to support mid-density logic designs with on-chip memory and a broad I/O count.

With a supply voltage range of 1.425 V to 1.575 V, 119 I/O and operation across −55 °C to 100 °C, this surface-mount 256-LBGA device targets demanding systems where temperature range, reliability and flexible logic are required.

Key Features

• Logic Capacity — 13,824 logic elements providing a total of 600,000 gates for implementing mid-density digital logic and custom datapaths.
• Embedded Memory — Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for buffering, state storage and small LUT-based memories.
• I/O — 119 I/O pins to support a variety of peripherals, interfaces and board-level connections.
• Voltage Range — Operates from 1.425 V to 1.575 V to match low-voltage system rails and power domains.
• Package & Mounting — 256-LBGA package (supplier package: 256-FPBGA, 17 × 17 mm) designed for surface-mount assembly in compact board layouts.
• Environmental & Grade — Military grade device, RoHS-compliant, specified for operation from −55 °C to 100 °C for extended-temperature deployments.

Typical Applications

• Defense & Military Electronics — Military-grade temperature and qualification make this FPGA suitable for avionics, communications and ruggedized processing modules requiring reconfigurable logic.
• Rugged Embedded Control — Use where extended temperature range and a mix of logic, memory and I/O are needed for embedded control, signal processing or custom state machines.
• High-Reliability Systems — Deployments that demand RoHS compliance, surface-mount packaging and predictable voltage rails can leverage this device for dependable reprogrammable logic.

Unique Advantages

• Balanced Logic Density: 13,824 logic elements and 600,000 gates provide a mid-density platform for complex glue logic, protocol bridging and moderate parallel processing.
• On-chip RAM: Approximately 0.11 Mbits of embedded memory reduces external SRAM requirements for control and buffering tasks.
• Extended Temperature Range: Specified operation from −55 °C to 100 °C supports deployment in harsh and temperature-variable environments.
• Compact, Board-Friendly Package: 256-LBGA (256-FPBGA, 17×17) enables a compact footprint while providing substantial I/O counts for system integration.
• Low-Voltage Operation: Narrow supply window (1.425 V to 1.575 V) aligns with low-voltage system architectures and simplifies power-domain planning.
• Military Grade & Compliance: Military grade designation and RoHS compliance address regulatory and reliability needs for defense and high-reliability projects.

Why Choose AFS600-FGG256K?

The AFS600-FGG256K positions itself as a mid-density, military-grade FPGA solution that combines a substantial logic fabric, on-chip memory and a flexible I/O count in a compact 256-LBGA footprint. It is well suited to engineers and programs needing reconfigurable logic with verified extended-temperature performance and RoHS compliance.

Backed by Microchip Technology, this Fusion® family device offers designers a scalable option for applications where temperature resilience, logic capacity and I/O density are key selection criteria.

Request a quote or submit a specification inquiry to learn about availability, pricing and lead times for the AFS600-FGG256K.