AFS600-FGG256

The AFS600-FGG256 is a Fusion® family Field Programmable Gate Array (FPGA) from Microchip Technology, supplied in a 256-LBGA package. This commercial-grade programmable logic device provides a balanced combination of logic capacity, embedded memory, and flexible I/O for commercial embedded applications.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory, 119 user I/O pins and support for a 1.425–1.575 V core supply, the device targets designs that require moderate logic density and on-chip RAM in a compact surface-mount package.

Key Features

• Logic Capacity — 13,824 logic elements (logic cells) for implementing custom logic, state machines and glue-logic functions.
• Embedded Memory — Approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) to support buffering, FIFOs and small-data storage without external memory.
• I/O Count — 119 user I/O pins suitable for interfacing to peripherals, sensors and other digital fabrics.
• Gate Equivalent — Approximately 600,000 gates of logic capacity to describe overall device scale and design density.
• Power and Supply — Core voltage supply range 1.425 V to 1.575 V to match typical FPGA power domains and regulator options.
• Package and Mounting — 256-LBGA / 256-FPBGA (17×17) surface-mount package for compact board-level integration.
• Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C, suitable for standard commercial electronics environments.
• Regulatory — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Use the device’s 13,824 logic elements and 119 I/Os to implement custom control, glue logic and peripheral interfaces in commercial electronics.
• Signal Conditioning and Data Handling — On-chip RAM (110,592 bits) and gate capacity enable buffering and basic data-path functions without external memory in space-constrained designs.
• Peripheral and Sensor Aggregation — 119 I/O pins provide flexibility to connect multiple sensors, actuators and external interfaces in a single FPGA-based controller.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM offer a practical combination for mid-range programmable designs.
• Compact Package: 256-LBGA (17×17) surface-mount packaging reduces board footprint while accommodating a substantial I/O count.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Clear Power Requirement: Narrow core supply range (1.425–1.575 V) simplifies power-rail planning and regulator selection.
• RoHS Compliant: Meets common lead-free requirements for modern electronics manufacturing.

Why Choose AFS600-FGG256?

The AFS600-FGG256 provides a practical mix of logic density, embedded memory and I/O in a compact 256-LBGA footprint, making it well suited to commercial embedded designs that require on‑board programmable logic without excessive board space. Its specified voltage range and commercial temperature rating simplify integration into standard design flows.

As a Fusion® family FPGA from Microchip Technology, this device offers designers a scalable option within a known vendor product line, supporting projects that need moderate gate count, programmable I/O and on‑chip RAM while maintaining RoHS compliance.

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