AFS600-2FGG484I

The AFS600-2FGG484I is a Fusion® field programmable gate array from Microchip Technology, delivered in a 484-ball BGA package. It integrates approximately 600,000 gates across 13,824 logic elements with embedded memory and a generous I/O count, aimed at industrial applications that require mid-range FPGA resources in a compact surface-mount package.

With industrial-grade operating range and a focused supply voltage window, this device suits designs that need predictable electrical and thermal characteristics while maintaining flexibility through FPGA programmability.

Key Features

• Logic Density  Approximately 13,824 logic elements providing roughly 600,000 gates to implement control, glue logic, and medium-complexity FPGA functions.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for buffering, FIFOs, and small on-chip data storage.
• I/O Capability  172 user I/O pins to support a mix of external interfaces, sensors, and peripherals directly from the FPGA fabric.
• Power  Designed for a core supply voltage range of 1.425 V to 1.575 V to match systems that use low-voltage FPGA cores.
• Package & Mounting  484-ball FPBGA package (23 × 23 mm footprint) with surface-mount mounting for compact board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Compliance  RoHS compliant to support environmental and regulatory requirements for electronic assemblies.

Typical Applications

• Industrial Control and Automation  Implement digital control, sequencing, and interface aggregation where industrial temperature operation and reliability are required.
• Communications and Protocol Bridging  Provide mid-density programmable logic for protocol conversion, custom framing, or peripheral aggregation using available I/O.
• Sensor and Data Acquisition Systems  Handle front-end logic, data buffering, and basic preprocessing with on-chip RAM and plentiful I/O.
• Embedded System Glue Logic  Consolidate multiple discrete interfaces and timing-critical control paths into a single programmable device to simplify PCB routing and BOM.

Unique Advantages

• Balanced Logic and Memory  Combines 13,824 logic elements with approximately 0.11 Mbits of embedded RAM to support a wide range of mid-complexity functions without external memory for small buffers.
• Generous I/O Count  172 I/O pins enable direct connection to multiple peripherals and sensors, reducing the need for additional interface chips.
• Industrial-ready Operation  Specified for −40 °C to 100 °C operation and supplied in an industry-standard BGA package for robust deployment in industrial systems.
• Compact BGA Packaging  484-FPBGA (23×23) provides a high connection density in a compact footprint suitable for space-constrained boards.
• Predictable Power Window  Core voltage range of 1.425 V–1.575 V supports consistent power planning and integration with low-voltage system rails.
• RoHS Compliance  Meets RoHS requirements, aiding compliance in regulated regions and reducing hazardous substances in assemblies.

Why Choose AFS600-2FGG484I?

The AFS600-2FGG484I positions itself as a practical, industrial-grade FPGA option for designers needing a balance of logic resources, on-chip memory, and I/O in a compact BGA package. Its specified operating temperature range and RoHS compliance make it suitable for a range of industrial applications where environmental robustness and regulatory conformity matter.

Engineers designing mid-complexity control, data acquisition, or protocol conversion systems will find the device’s combination of logic density, embedded RAM, and 172 I/Os useful for consolidating functions, reducing board-level components, and simplifying system architecture.

If you would like pricing or availability, request a quote or submit an inquiry to receive tailored ordering and supply information for the AFS600-2FGG484I.