AFS600-2FGG256

The AFS600-2FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology targeted at commercial‑grade programmable logic applications. It provides a mid‑density programmable fabric with 13,824 logic elements and 110,592 bits of on‑chip RAM, alongside 119 general I/Os for system integration.

Packaged in a compact 256‑LBGA (256‑FPBGA, 17×17) surface‑mount case with a 1.425 V to 1.575 V core supply and an operating temperature range of 0 °C to 85 °C, the device is intended for designers requiring configurable logic, embedded memory, and a balanced I/O count in commercial systems.

Key Features

• Programmable Logic Core 13,824 logic elements (cells) provide the programmable fabric for implementing custom digital logic and state machines.
• Embedded Memory 110,592 total RAM bits of on‑chip memory for buffering, small data tables, and control state storage.
• I/O Count 119 general I/Os to interface with peripherals, buses, and external devices in mixed‑signal and digital designs.
• Package and Mounting 256‑LBGA (supplier package: 256‑FPBGA, 17×17) in a surface‑mount form factor to minimize board area while supporting robust soldering processes.
• Power Core voltage supply range of 1.425 V to 1.575 V to match system power rails and FPGA core requirements.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C to meet commercial application environmental needs.
• Regulatory RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement custom digital functions, protocol bridging, and peripheral control within commercial devices.
• Prototyping and Development — Use the FPGA’s logic capacity and I/O resources for design validation and feature evaluation.
• Communications and Networking (Commercial) — Provide protocol adaptation, framing, or interface logic where moderate logic density and on‑chip RAM are required.
• Test and Measurement Equipment — Implement control logic and data handling functions in laboratory and benchtop instruments.

Unique Advantages

• Mid‑Density Logic Capacity: 13,824 logic elements deliver programmable resources sufficient for control, interfacing, and moderate complexity designs without excessive cost or board area.
• On‑Chip Memory: 110,592 bits of embedded RAM reduce external memory needs for many control and buffering tasks, simplifying BOM and layout.
• Generous I/O Count: 119 I/Os enable flexible connectivity to peripherals, sensors, and external logic without immediate reliance on external I/O expanders.
• Compact BGA Package: 256‑LBGA (256‑FPBGA, 17×17) provides a small footprint for space‑constrained commercial products while supporting surface‑mount assembly.
• Commercial Temperature Rating: Operation from 0 °C to 85 °C aligns with typical commercial product environments and deployment scenarios.
• RoHS Compliance: Conforms to environmental requirements for lead‑free assembly and regulatory expectations.

Why Choose AFS600-2FGG256?

The AFS600-2FGG256 positions itself as a balanced, commercial‑grade FPGA offering from Microchip Technology that combines mid‑density logic, useful on‑chip RAM, and substantial I/O in a compact 256‑LBGA package. Its supply voltage range and commercial temperature rating make it suitable for a wide range of commercial embedded designs where configurable logic and local memory reduce system complexity.

Designers seeking a scalable, vendor‑backed programmable logic option for prototyping, communications interface tasks, and commercial product integration will find the AFS600-2FGG256 a practical choice that streamlines board design and part selection while maintaining regulatory compliance for RoHS.

Request a quote or submit an inquiry for the AFS600-2FGG256 to get pricing and availability information for your project.