AFS600-2FG256I

The AFS600-2FG256I is a Fusion® field programmable gate array (FPGA) delivered in a 256-LBGA footprint. It provides a balanced combination of logic capacity, embedded memory, and programmable I/O suitable for industrial embedded designs.

Featuring approximately 13,824 logic elements, roughly 0.11 Mbits of embedded memory, and 119 I/O pins, the device targets applications that require moderate logic density, on-chip RAM, and flexible interfacing within a compact surface-mount package.

Key Features

• Core Logic: Approximately 13,824 logic elements and 600,000 gates provide the programmable resources for custom digital functions and glue logic.
• Embedded Memory: Total on-chip RAM of 110,592 bits, approximately 0.11 Mbits of embedded memory for buffering, state storage, and small lookup tables.
• I/O Capacity: 119 programmable I/O pins to support multiple external interfaces and signal connections.
• Power Supply: Specified operating voltage range of 1.425 V to 1.575 V for core power planning and regulator selection.
• Package & Mounting: 256-LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount construction for compact board integration.
• Operating Range: Industrial-grade temperature range from −40 °C to 100 °C for deployment in a wide range of environmental conditions.
• Compliance: RoHS compliant for environmental and lead-free process considerations.

Unique Advantages

• Balanced logic density: ~13,824 logic elements deliver programmable capacity suited to mid-range digital functions without excessive die size.
• On-chip memory availability: Approximately 0.11 Mbits of embedded RAM reduces reliance on external memory for small buffers and lookup tables.
• Generous I/O count: 119 I/O pins enable integration with multiple peripherals, sensors, and interfaces on a single device.
• Compact BGA package: 256-LBGA / 256-FPBGA (17×17) allows high-density PCB implementations while maintaining a surface-mount assembly flow.
• Industrial temperature rating: −40 °C to 100 °C supports use in harsher environments and extended temperature applications.
• Clear power envelope: Defined core supply range (1.425 V–1.575 V) simplifies power-supply design and verification.

Why Choose AFS600-2FG256I?

The AFS600-2FG256I combines moderate logic capacity, embedded RAM, and a substantial I/O complement in a compact 256-LBGA package targeted for industrial applications. Its defined supply voltage range and wide operating temperature make it appropriate for designs that require stable operation across varying environmental conditions.

This device is well suited for engineers seeking a mid-density FPGA solution that balances integration and board-level footprint while keeping on-chip memory and flexible I/O readily available. Its RoHS compliance and surface-mount package support standard manufacturing flows and regulatory expectations.

Request a quote or submit a purchase inquiry to receive pricing, availability, and lead-time details for the AFS600-2FG256I. Our team can assist with ordering and technical confirmation for your project needs.