AFS600-2FGG256I

The AFS600-2FGG256I from Microchip Technology is a Fusion® field programmable gate array (FPGA) supplied in a 256-LBGA package. It provides a mid-range logic resource set with integrated embedded memory and a defined industrial temperature grade for embedded and control-focused designs.

With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and 119 general-purpose I/O, this device targets applications that require configurable hardware resources, moderate on-chip memory and robust environmental tolerance.

Key Features

• Logic Capacity — 13,824 logic elements to implement custom logic, state machines and combinational/sequential functions.
• Embedded Memory — 110,592 total RAM bits, approximately 0.11 Mbits of embedded memory for buffering, small FIFOs and local data storage.
• I/O Resources — 119 user I/O pins to interface with sensors, peripherals and external logic.
• Supply Voltage — Operates from 1.425 V to 1.575 V, suitable for designs targeting this core voltage domain.
• Industrial Temperature Range — Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Package and Mounting — Surface-mount 256-LBGA (supplier package: 256-FPBGA 17×17) for compact board-level integration.
• Environmental Compliance — RoHS compliant, supporting regulatory requirements for reduced hazardous substances.

Typical Applications

• Industrial Control — The –40 °C to 100 °C temperature range and 119 I/O make the device suitable for control logic, I/O aggregation and deterministic processing in industrial systems.
• Embedded Signal Processing — 13,824 logic elements and on-chip RAM support implementation of custom data paths, pre-processing and protocol handling in embedded equipment.
• Sensor and Actuator Interfaces — Multiple I/O and programmable logic allow integration of sensor conditioning, filtering and actuator drive logic on a single FPGA.
• Communications and Protocol Bridging — Configurable logic and I/O count enable protocol translation, glueless interfacing and custom peripheral bridging in communications modules.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM provide a compact platform for mid-complexity designs without external memory.
• Industrial-grade Operation: Specified –40 °C to 100 °C operation supports deployment in harsher environments where temperature resilience is required.
• Ample I/O in a Compact Package: 119 I/O in a 256-LBGA (17×17) footprint helps reduce PCB area while providing flexible external connectivity.
• Controlled Core Supply: Defined supply range (1.425 V–1.575 V) simplifies power rail planning for designs using this device family’s core voltage.
• Regulatory Compliance: RoHS-compliant construction to meet lead-free and hazardous substance requirements.

Why Choose AFS600-2FGG256I?

The AFS600-2FGG256I positions itself as a mid-range Fusion® FPGA option for designers who need a reliable, industrial-grade programmable logic device with a balanced mix of logic, embedded memory and I/O. Its defined voltage range, industrial temperature rating and compact 256-LBGA package make it suitable for embedded control, signal interfacing and protocol tasks where board space and environmental tolerance matter.

This part is well suited to engineering teams seeking a Microchip Technology FPGA that delivers predictable electrical and thermal characteristics, moderate logic density and on-chip RAM for consolidated, configurable hardware subsystems.

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