AFS600-2FG484I

The AFS600-2FG484I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 484-ball BGA package. It provides a balance of logic capacity, on-chip memory and I/O density for industrial embedded designs.

Key architectural attributes include 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 172 user I/O pins, enabling custom digital logic implementation in temperature-sensitive, industrial environments.

Key Features

• Core Capacity  13,824 logic elements and 600,000 gates provide programmable fabric for implementing custom logic, state machines and glue logic.
• On‑Chip Memory  Approximately 0.11 Mbits of embedded RAM (110,592 bits) for FIFOs, buffers and small data storage directly in the FPGA fabric.
• I/O and Connectivity  172 user I/O pins support broad signal interfacing and peripheral aggregation in compact designs.
• Package & Mounting  484-BGA surface-mount package (supplier package: 484-FPBGA, 23×23 mm) for dense board layouts and reliable solder attachment.
• Power  Core voltage supply range of 1.425 V to 1.575 V to match system power rails and enable predictable power design.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial temperature environments.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial control and automation  Implement custom control logic, signal processing and I/O aggregation using the device's logic capacity and wide operating temperature range.
• Embedded system glue logic  Replace multiple discrete components with programmable logic for board-level consolidation and flexibility.
• Interface consolidation  Aggregate and translate multiple peripheral signals using 172 I/O pins and on-chip memory for buffering and timing.

Unique Advantages

• High programmable capacity: 13,824 logic elements and 600,000 gates enable significant on-board logic integration without external ASICs.
• On-chip memory for buffering: Approximately 0.11 Mbits of embedded RAM supports FIFO, buffering and small data storage close to logic.
• Broad I/O availability: 172 user I/Os allow extensive peripheral and sensor interfacing without additional I/O expanders.
• Industrial suitability: −40 °C to 100 °C operating range aligns with industrial deployment requirements.
• Compact BGA footprint: 484-FPBGA (23×23 mm) surface-mount package supports high-density PCB layouts and reliable assembly.
• RoHS compliant: Meets environmental compliance expectations for modern manufacturing processes.

Why Choose AFS600-2FG484I?

AFS600-2FG484I is positioned for engineers seeking industrial-grade programmable logic with a balanced mix of logic elements, embedded memory and extensive I/O in a compact BGA package. Its combination of 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM and 172 I/Os makes it well suited to consolidate functions, reduce BOM complexity and adapt hardware behavior through reprogrammable logic.

Manufactured by Microchip Technology and delivered in a surface-mount 484-FPBGA (23×23 mm) package, this FPGA offers a practical, verifiable foundation for industrial and embedded designs that require predictable operating temperature tolerance and RoHS compliance.

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