AFS600-2FG256

The AFS600-2FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC provided in a 256-ball LBGA package. It integrates 13,824 logic elements with approximately 0.11 Mbits of on-chip RAM and 119 general-purpose I/O pins to address a range of commercial programmable-logic requirements.

Designed for commercial-grade applications, the device operates from a 1.425 V to 1.575 V core supply and within a 0 °C to 85 °C ambient range, and is supplied in a compact 256-FPBGA (17×17) package for surface-mount assembly.

Key Features

• Logic Capacity  13,824 logic elements (cells) provide the programmable fabric for custom digital logic and control functions.
• Embedded Memory  Approximately 0.11 Mbits of total on-chip RAM bits for data buffering, small lookup tables, and state retention.
• I/O Count  119 available I/O pins to support a broad mix of external interfaces and peripheral connections.
• Gate Density  Around 600,000 gates for implementing combinational and sequential logic in commercial designs.
• Power  Core voltage range of 1.425 V to 1.575 V to match required system supply rails and power budgeting.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA, 17×17) optimized for surface-mount assembly in space-constrained boards.
• Operating Range  Commercial-grade temperature rating from 0 °C to 85 °C suitable for typical commercial electronic environments.
• Regulatory  RoHS compliant.

Typical Applications

• Commercial embedded systems  Programmable logic for control, timing, and custom processing functions in non-industrial applications.
• I/O-intensive control  Leverage 119 I/O pins for multi-channel interfacing, peripheral aggregation, and board-level glue logic.
• Prototyping and development  Provides a moderate logic and memory footprint for proof-of-concept designs and feature validation in commercial projects.

Unique Advantages

• Balanced logic and memory  13,824 logic elements combined with approximately 0.11 Mbits of on-chip RAM allow compact implementations of control and data-path functions.
• Generous I/O availability  119 I/O pins support diverse peripheral and interface requirements without immediate need for external IO expanders.
• Compact, surface-mount package  256-LBGA (256-FPBGA, 17×17) enables high-density board layouts while maintaining a standard surface-mount assembly process.
• Commercial readiness  0 °C to 85 °C operating range and RoHS compliance align the device with standard commercial product requirements.
• Straightforward power requirements  A narrow core supply window (1.425 V–1.575 V) simplifies power-supply design and sequencing.

Why Choose AFS600-2FG256?

The AFS600-2FG256 positions itself as a commercially graded, mid-capacity FPGA option that combines meaningful logic density, embedded RAM, and a substantial I/O complement in a compact 256-LBGA form factor. It is suited to designers seeking programmable logic integration for commercial embedded systems, I/O aggregation, and prototyping tasks where board space and supply constraints matter.

With RoHS compliance and a defined operating and power envelope, the AFS600-2FG256 delivers predictable integration into commercial product workflows while providing the flexibility of field-programmable logic for evolving design requirements.

Request a quote or submit an inquiry to receive pricing and availability for the AFS600-2FG256 and to discuss how this Fusion® FPGA can fit into your next commercial design.