AFS600-1FGG484

The AFS600-1FGG484 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology targeted for commercial applications. It integrates 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 172 I/O pins in a 484-FPBGA (23×23) surface-mount package.

This device is intended for designs that require moderate programmable logic capacity, on-chip RAM, and a substantial I/O count within a compact BGA package. It operates over a 1.425 V to 1.575 V supply range and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Logic Capacity  13,824 logic elements providing a foundation for implementing custom digital logic and control functions.
• Embedded Memory  110,592 total RAM bits (approximately 0.11 Mbits) for on-chip data buffering, state storage, and small lookup tables.
• Gate Count  Approximately 600,000 gates for expressing combinational and sequential circuitry in compact designs.
• I/O  172 I/O pins to support multiple interfaces, peripheral connections, and system-level signal routing.
• Power  Specified supply voltage range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package and Mounting  484-FPBGA (23×23) package in a 484-BGA footprint, designed for surface-mount assembly in space-constrained boards.
• Operating Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

• Commercial Embedded Systems  Implement custom control logic and peripheral interfacing where moderate logic density and on-chip RAM are needed.
• Prototyping and Development  Use the FPGA’s logic capacity and I/O count to evaluate and iterate digital designs before production.
• I/O Bridging and Glue Logic  Consolidate multiple interface functions and translate signals between subsystems using available I/Os and programmable logic.
• Custom Acceleration  Offload and accelerate selected functions within commercial equipment using the device’s logic and on-chip memory resources.

Unique Advantages

• Balanced Logic and Memory  Combines 13,824 logic elements with approximately 0.11 Mbits of embedded RAM to support a range of control and data-path tasks.
• Generous I/O Count  172 I/Os allow implementation of multiple interfaces and parallel signal paths without external multiplexing.
• Compact BGA Footprint  484-FPBGA (23×23) package enables high-density board integration while keeping a small PCB area.
• Commercial Temperature Support  Rated for 0 °C to 85 °C operation to meet typical commercial environment requirements.
• RoHS Compliant  Designed for lead-free, environmentally conscious manufacturing processes.
• Vendor-backed Reliability  Manufactured by Microchip Technology and supplied in a standard surface-mount package for established assembly flows.

Why Choose AFS600-1FGG484?

The AFS600-1FGG484 provides a practical combination of logic elements, on-chip RAM, and I/O density in a compact 484-FPBGA package for commercial embedded designs. Its electrical and thermal ratings (1.425 V–1.575 V supply, 0 °C–85 °C operation) make it suitable for systems that require reliable programmable logic within defined commercial environments.

This FPGA suits engineering teams and procurement groups looking for a RoHS-compliant, surface-mount programmable device that balances integration and board-level footprint while supporting a variety of custom logic and interfacing tasks.

Request a quote or submit an inquiry today to obtain pricing and availability for the AFS600-1FGG484. Our team will provide the next steps to add this Fusion® FPGA to your design.