AFS600-1FGG256

The AFS600-1FGG256 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology that combines programmable logic, embedded memory, and a substantial I/O count in a compact 256-LBGA package. It provides 13,824 logic elements, approximately 110,592 bits of embedded memory and 119 general-purpose I/O for flexible digital design integration.

Targeted for commercial-grade embedded designs, this device operates from a 1.425 V to 1.575 V supply and across a 0 °C to 85 °C operating range, making it suitable for a wide range of standard-temperature applications that require on-chip logic, memory and I/O consolidation.

Key Features

• Core Logic 13,824 logic elements (cells) and approximately 600,000 gates enable implementation of complex custom digital functions and control logic.
• Embedded Memory Approximately 110,592 bits of on-chip RAM provide local buffering and data storage for implemented logic functions.
• I/O 119 available I/O pins support broad interfacing options for external peripherals and system-level connectivity.
• Power Specified supply range of 1.425 V to 1.575 V for core operation, allowing precise power planning for the design.
• Package & Mounting Supplied in a 256-LBGA package (supplier package: 256-FPBGA, 17×17) and intended for surface-mount assembly.
• Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for adherence to common environmental regulations.

Typical Applications

• Custom digital logic — Implement protocol handling, parallel/serial data paths or bespoke state machines using the device’s 13,824 logic elements.
• I/O-centric designs — Use the 119 I/O pins to aggregate signals, interface with sensors, peripherals and external controllers in compact systems.
• On-chip buffering and data handling — Leverage approximately 110,592 bits of embedded memory for temporary storage, FIFOs or small RAM-based processing tasks.

Unique Advantages

• Balanced logic and memory integration: Combines 13,824 logic elements with approximately 110,592 bits of embedded RAM to reduce the need for external memory and simplify board-level design.
• High I/O count in a compact package: 119 I/Os in a 256-LBGA (256-FPBGA 17×17) package enables dense connectivity while maintaining a small PCB footprint.
• Tight supply specification: A defined core voltage range (1.425 V to 1.575 V) supports predictable power budgeting and thermal planning.
• Commercial-temperature suitability: Rated for 0 °C to 85 °C operation, matching common commercial embedded product requirements.
• RoHS compliant: Conforms to environmental standards that simplify regulatory considerations for many markets.

Why Choose AFS600-1FGG256?

The AFS600-1FGG256 positions itself as a compact, commercially graded FPGA option for designers who need a balance of programmable logic, on-chip memory and substantial I/O in a single package. Its combination of 13,824 logic elements, approximately 110,592 bits of embedded RAM and 119 I/Os makes it well suited to embedded systems that require consolidation of digital functions and local data handling.

Backed by Microchip Technology, this device is appropriate for OEMs and embedded designers building commercial-temperature products who require predictable supply and thermal characteristics, RoHS compliance and a compact 256-LBGA footprint for surface-mount assembly.

Request a quote or submit an inquiry to get pricing and availability for the AFS600-1FGG256. Our team can provide delivery lead times and ordering information to support your design schedule.