AFS600-1FG484I

The AFS600-1FG484I is a Fusion® Field Programmable Gate Array providing 600,000 gates and 13,824 logic elements in a 484-BGA package. It integrates approximately 110,592 bits of on-chip RAM and offers 172 user I/O pins for board-level programmable logic designs.

Designed for surface-mount assembly and specified for industrial use, this device operates from a core supply range of 1.425 V to 1.575 V and across an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant and supplied in a 484-FPBGA (23×23) package footprint.

Key Features

• Core Capacity — 600,000 gates and 13,824 logic elements deliver a mid-range programmable-logic resource suitable for complex glue logic, protocol handling, and control functions.
• Embedded Memory — Approximately 110,592 bits of on-chip RAM provide local storage for buffers, FIFOs, and state machines without external memory.
• I/O — 172 user I/O pins enable flexible interface options for parallel control, bus interfaces, and multi-signal connectivity on the PCB.
• Power — Core supply operating range of 1.425 V to 1.575 V allows precise power budgeting and integration into regulated power architectures.
• Package & Mounting — 484-BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount format supports compact board layouts and standard BGA assembly workflows.
• Temperature & Grade — Industrial-grade device rated for −40 °C to 100 °C operation, suitable for temperature-challenging environments.
• Environmental Compliance — RoHS-compliant construction supports regulatory and corporate environmental requirements.

Typical Applications

• Industrial Control — Programmable logic and plentiful I/O make the FPGA suitable for control, sequencing, and interface consolidation in industrial systems operating across an industrial temperature range.
• I/O-Intensive Embedded Systems — With 172 I/O pins, the device supports designs requiring multiple parallel interfaces, sensor aggregation, or bus bridging on a single chip.
• On-Board Logic and Memory — The combination of 13,824 logic elements and embedded RAM is well suited for local data buffering, finite-state machines, and timing-critical logic implemented on the board.

Unique Advantages

• Balanced Logic and Memory: 13,824 logic elements paired with approximately 110,592 bits of RAM allow designers to implement both combinational and stateful functions without immediate dependence on external memory.
• Substantial I/O Count: 172 user I/O pins reduce board-level multiplexing and external glue logic, simplifying PCB routing for multi-interface designs.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in harsher environments where extended temperature tolerance is required.
• Compact BGA Package: The 484-FPBGA (23×23) package enables dense placement and reliable solder-joint mechanical performance for surface-mount assemblies.
• RoHS Compliance: Environmentally compliant materials support modern manufacturing and regulatory needs.

Why Choose AFS600-1FG484I?

The AFS600-1FG484I positions itself as a mid-capacity Fusion® FPGA that balances logic density, on-chip RAM, and a high I/O count in a compact BGA footprint. Its industrial-grade temperature rating and surface-mount BGA package make it suitable for embedded and board-level designs where reliable programmable logic and ample connectivity are required.

This device is appropriate for engineering teams focused on reducing external components while maintaining flexible programmable resources; its combination of gate count, logic elements, embedded RAM, and I/O supports scalable designs with clear integration and reliability considerations.

Request a quote today to obtain pricing and availability for the AFS600-1FG484I and to discuss how this Fusion® FPGA can meet your design requirements.