AFS250-FGG256

The AFS250-FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC providing programmable logic, embedded memory, and a broad set of I/O in a compact BGA package. It delivers 6,144 logic elements and approximately 36,864 bits (≈0.037 Mbits) of on-chip RAM, suited to commercial electronic designs that require moderate logic density and configurable interfaces.

Key attributes include 114 I/O pins, a supply voltage range of 1.425 V to 1.575 V, and a commercial operating temperature range of 0 °C to 85 °C, supplied in a 256-ball FPBGA (17×17) surface-mount package.

Key Features

• Core Logic 6,144 logic elements providing a practical programmable fabric for custom logic, control functions, and glue logic.
• Logic Capacity Reported 250,000 gates, enabling implementation of moderate-complexity designs within a single device.
• Embedded Memory Approximately 36,864 bits of on-chip RAM for temporary storage, buffering, and small lookup tables.
• I/O 114 user I/O pins to interface with peripherals, sensors, and external logic in board-level designs.
• Power Operates from a core supply of 1.425 V to 1.575 V to match low-voltage system rails.
• Package & Mounting 256-ball FPBGA (256-LBGA) surface-mount package, supplier package specified as 256-FPBGA (17×17).
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C for standard commercial electronics applications.
• Environmental Compliance RoHS compliant for lead-free, environmentally conscious assembly and production processes.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol handling, or interface bridging inside commercial electronic products.
• Prototyping and Development — Rapidly iterate hardware functionality and validate logic before committing to fixed-function ASICs or SoCs.
• User Interfaces and Control — Drive and manage peripheral I/O, button/key scanning, and simple display/control logic using the available I/O and on-chip resources.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements and 250,000 gates provide a middle-ground capacity for many commercial designs without excessive cost or board area.
• Integrated Memory: On-chip RAM (36,864 bits) reduces the need for small external memory components for buffering and LUTs.
• Generous I/O Count: 114 I/O pins allow direct interfacing to a variety of peripherals and external logic devices.
• Compact BGA Packaging: 256-ball FPBGA (17×17) surface-mount package minimizes PCB footprint while enabling reliable soldered connections.
• Low-Voltage Core: Core supply specified between 1.425 V and 1.575 V to align with low-voltage system architectures.
• RoHS Compliant: Meets lead-free environmental requirements for modern electronics manufacturing.

Why Choose AFS250-FGG256?

The AFS250-FGG256 positions itself as a compact, commercial-grade FPGA option for designers who need moderate programmable logic, embedded RAM, and substantial I/O in a small BGA package. Its combination of 6,144 logic elements, approximately 36.9 kbits of embedded memory, and 114 I/O pins makes it well suited for a range of commercial applications where board space, reconfigurability, and environmental compliance matter.

Choose this device when your design requires scalable programmable logic with a predictable operating voltage and commercial temperature range, supported by a surface-mount 256-ball FPBGA package for dense PCB integration.

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