AFS250-2FG256I

The AFS250-2FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology targeted at industrial embedded designs. It integrates 6,144 logic elements and approximately 0.037 Mbits of embedded memory, delivering a compact programmable platform for custom logic and I/O-centric applications.

Packaged in a 256-LBGA (supplier package: 256-FPBGA, 17×17) and rated for industrial operation, this device provides up to 114 I/Os and a supply voltage range of 1.425 V to 1.575 V, suitable for systems that require stable logic integration across a wide operating temperature span.

Key Features

• Core Logic — 6,144 logic elements (CLBs) supporting up to 250,000 gates for mid-scale programmable logic implementations.
• Embedded Memory — 36,864 bits of on-chip RAM, approximately 0.037 Mbits, for small data buffering and state storage.
• I/O Density — Up to 114 general-purpose I/O pins to support multiple interfaces and custom glue-logic tasks.
• Package & Mounting — 256-LBGA package (supplier: 256-FPBGA, 17×17) optimized for surface-mount assembly in compact system designs.
• Power — Defined core supply range from 1.425 V to 1.575 V for predictable power integration and design margins.
• Industrial Temperature Range — Specified to operate from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance — RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Implement custom control logic and signal conditioning in systems that require industrial temperature operation and robust I/O counts.
• Interface and Glue Logic — Consolidate protocol bridging and bus interfacing using the device’s 114 I/Os and programmable logic resources.
• Embedded Systems — Deploy as the core programmable element in compact, surface-mount embedded designs thanks to the 256-LBGA package and integrated logic/memory.

Unique Advantages

• Mid-scale Programmability: 6,144 logic elements and 250,000 gates provide substantial on-chip logic for a wide range of configurable functions without external ASICs.
• Integrated I/O Capacity: 114 I/Os enable consolidation of multiple interface functions and reduce external component count.
• Compact Surface-Mount Packaging: 256-LBGA (256-FPBGA, 17×17) reduces PCB footprint while maintaining thermal and mechanical compatibility with industry-standard assembly.
• Industrial Robustness: Rated for −40 °C to 100 °C operation to support deployments in demanding environmental conditions.
• Controlled Power Envelope: Narrow supply range (1.425 V–1.575 V) aids predictable power delivery and system-level design.
• RoHS Compliance: Meets common environmental directives for lead-free manufacturing.

Why Choose AFS250-2FG256I?

The AFS250-2FG256I positions itself as a compact, industrial-grade FPGA solution that balances logic capacity, I/O density, and a small package footprint. Its combination of 6,144 logic elements, 114 I/Os, and defined electrical and thermal ranges makes it well suited for embedded and industrial designs that require dependable programmable logic in a surface-mount form factor.

Designed for teams seeking a scalable, RoHS-compliant programmable device, this FPGA offers straightforward integration into existing PCB layouts and supports long-term deployment in environments that demand extended temperature tolerance and consistent supply requirements.

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