AFS250-1FGG256

The AFS250-1FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a moderate-density reconfigurable logic fabric with embedded memory and a substantial I/O count in a compact 256-LBGA package for commercial applications.

Designed for commercial-grade embedded systems, the device targets designs that require configurable logic, on-chip memory, and flexible I/O in a surface-mount, RoHS-compliant package.

Key Features

• Logic Capacity — 6,144 logic elements (reported as Number Of Labs Clbs / Number Of Logic Elements Cells).
• Embedded Memory — 36,864 bits of on-chip RAM (approximately 0.037 Mbits) to support buffering, small FIFOs, and state storage.
• I/O Resources — 114 user I/O pins suitable for interfacing with peripherals and system buses.
• Gate Count — 250,000 equivalent gates for implementing combinational and sequential logic functions.
• Power — Core supply voltage range of 1.425 V to 1.575 V for low-voltage operation.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17 mm) with surface-mount mounting type for compact PCB designs.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Reconfigurable logic and I/O for control and interface tasks in general-purpose embedded products.
• Peripheral Bridging — Implement protocol adapters or custom I/O aggregation using the device’s 114 I/O pins and embedded logic.
• Prototyping and Development — Use the FPGA fabric and on-chip RAM for hardware prototyping where moderate logic density and reprogrammability are required.

Unique Advantages

• Moderate Logic Density: 6,144 logic elements provide a balance between capacity and cost for mid-range FPGA designs.
• Compact LBGA Footprint: 256-LBGA (17 × 17 mm) package enables high-density PCB layouts while maintaining significant I/O count.
• Low-Voltage Core: 1.425 V to 1.575 V supply compatibility supports low-voltage system architectures.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, matching typical commercial deployment environments.
• RoHS Compliance: Environmentally compliant for global commercial product assembly.

Why Choose AFS250-1FGG256?

The AFS250-1FGG256 positions itself as a practical Fusion FPGA option for commercial designs that need moderate logic capacity, a clear on-chip memory footprint, and a high number of user I/Os in a compact surface-mount package. Its combination of 6,144 logic elements, 36,864 bits of embedded RAM, and 114 I/O pins makes it suitable for embedded control, interfacing, and prototyping tasks.

Choose this Microchip Technology FPGA when your design calls for reconfigurable logic with a defined operating voltage range and commercial temperature rating, delivered in a RoHS-compliant 256-LBGA package.

Request a quote or contact sales to discuss availability, pricing, and how the AFS250-1FGG256 can fit into your next commercial FPGA design.