AFS1500-FGG676

The AFS1500-FGG676 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial-grade programmable-logic applications. It combines high logic capacity, substantial I/O count and on-chip memory in a 676-FBGA package to support compact, high-density board designs.

Key attributes include 1,500,000 gates, 38,400 logic elements, approximately 0.28 Mbits of embedded memory and 252 user I/O, with supply voltage and operating range suitable for commercial environments.

Key Features

• Core Density  1,500,000 gates and 38,400 logic elements provide significant programmable logic capacity for complex glue logic, custom processing and control functions.
• Embedded Memory  Approximately 0.28 Mbits of on-chip RAM (276,480 total RAM bits) for buffering, small data storage and state machines.
• I/O Capability  252 user I/O pins support designs that require extensive external connectivity and signal routing.
• Power  Operates from a core supply voltage range of 1.425 V to 1.575 V, enabling predictable power design within that range.
• Package and Mounting  676-FBGA (27x27) package in a surface-mount form factor for space-efficient PCB integration.
• Operating Conditions  Commercial-grade operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial deployments.

Typical Applications

• Commercial Embedded Systems  Use the AFS1500-FGG676 to implement programmable control, custom interfaces and protocol handling in commercial electronic products.
• High-Density I/O Designs  The 252 I/O pins are suited to applications that require multiple external connections in a compact package footprint.
• Custom Logic and Glue  Deploy the device to consolidate platform-specific logic and system interconnect functions, leveraging the device’s gate count and logic elements.
• On-Board Memory and Buffering  Embedded RAM (approx. 0.28 Mbits) supports temporary data storage, FIFOs and small buffering needs within system designs.

Unique Advantages

• High Logic Capacity:  1,500,000 gates and 38,400 logic elements enable substantial on-chip programmability without external ASICs for many design functions.
• Generous I/O Count:  252 I/O pins reduce the need for external I/O expanders and simplify board-level routing for multi-signal applications.
• Compact, Surface-Mount Packaging:  676-FBGA (27x27) and surface-mount mounting allow dense PCB layouts while retaining accessibility to a large number of I/Os.
• Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployments and regulatory alignment.
• Predictable Power Envelope:  Defined core supply voltage range (1.425 V to 1.575 V) aids in power-supply selection and thermal planning.

Why Choose AFS1500-FGG676?

The AFS1500-FGG676 positions itself as a high-density Fusion® FPGA option for commercial designs that require a combination of large programmable logic capacity, extensive I/O and on-chip RAM in a compact BGA package. Its specification set supports integration of complex logic functions and significant interfacing within a single, surface-mount component.

Engineers and procurement teams designing commercial embedded systems or high-I/O platforms can leverage the AFS1500-FGG676 to reduce external component count and simplify board-level integration, while relying on Microchip Technology’s Fusion FPGA family credentials.

Request a quote or submit a pricing and availability inquiry to start specifying the AFS1500-FGG676 for your next commercial FPGA design.