AFS1500-FGG484I

The AFS1500-FGG484I is a Fusion® Field Programmable Gate Array (FPGA) IC in a 484-ball BGA package supplied by Microchip Technology. It provides a mid-range programmable logic resource with 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 223 user I/Os, packaged for surface-mount assembly.

Specified for industrial-grade operation (–40°C to 100°C) and a core supply range of 1.425 V to 1.575 V, this device is suited to designs that require configurable logic, a substantial I/O footprint, and industrial temperature capability.

Key Features

• Core Logic — 38,400 logic elements (equivalent to 1,500,000 gates) to implement custom digital functions and glue logic.
• Embedded Memory — Approximately 0.276 Mbits (276,480 bits) of on-chip RAM for buffering, state storage, and small look-up tables.
• I/O Capacity — 223 user I/Os to support multiple parallel interfaces, sensor arrays, or mixed-signal front ends when combined with external components.
• Package and Mounting — 484-BGA (484-FPBGA, 23×23) surface-mount package for high pin-density PCB implementations in compact footprints.
• Power — Core supply voltage range of 1.425 V to 1.575 V for integration with low-voltage system rails.
• Industrial Temperature Range — Rated for operation from –40°C to 100°C, providing suitability for industrial-temperature applications.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Programmable logic and industrial temperature rating support control, sequencing, and I/O aggregation in factory and process environments.
• Interface Bridging and Protocol Conversion — 223 I/Os enable the device to act as a flexible bridge between multiple peripheral interfaces or bus standards.
• Embedded Systems and Prototyping — Logic density and on-chip RAM accommodate custom peripheral logic, state machines, and early-stage system validation.
• Test and Measurement Equipment — Compact BGA package combined with extensive I/O and configurable logic makes integration into instrumentation designs straightforward.

Unique Advantages

• Substantial Logic Capacity: 38,400 logic elements provide room for medium-complexity digital designs without external ASIC development.
• High I/O Count: 223 user I/Os reduce the need for external I/O expanders and simplify board-level interfacing.
• Compact, High-Density Packaging: 484-ball FPBGA (23×23) supports dense PCB layouts while keeping a small board footprint.
• Industrial Temperature Rating: –40°C to 100°C operation supports deployments in harsher environments.
• Low-Voltage Core Compatibility: Narrow core supply range (1.425 V–1.575 V) aligns with modern low-voltage power domains.
• RoHS Compliant: Meets common environmental compliance requirements for lead-free manufacturing.

Why Choose AFS1500-FGG484I?

The AFS1500-FGG484I balances a substantial set of programmable resources—38,400 logic elements and approximately 0.276 Mbits of embedded memory—with a high I/O count in a compact 484-BGA package. Its industrial temperature rating and defined low-voltage core range make it a practical choice for designers needing configurable logic in industrial and embedded applications.

Backed by Microchip Technology, this Fusion® FPGA option is appropriate for projects that require a mid-range FPGA footprint, flexible I/O, and surface-mount packaging for volume PCB assembly.

Request a quote or submit an inquiry to obtain pricing and availability for the AFS1500-FGG484I for your next design.