AFS1500-FGG256K

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA

Quantity 1,075 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeMilitaryOperating Temperature-55°C – 100°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of AFS1500-FGG256K – 119 I/O, 256-LBGA Fusion® FPGA

The AFS1500-FGG256K is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 256-LBGA surface-mount package. It integrates 38,400 logic elements, 1,500,000 gates and approximately 0.276 Mbits of on-chip RAM to implement custom digital logic in a compact form factor.

Designed for applications that require a military-grade component and extended temperature operation, this device supports a core supply range of 1.425 V to 1.575 V and an operating range of –55°C to 100°C, making it suitable for harsh-environment embedded designs.

Key Features

  • Logic Capacity
    Provides 38,400 logic elements (logic cells) and 1,500,000 gates to implement complex custom logic and control functions.
  • Embedded Memory
    Contains approximately 0.276 Mbits of on-chip RAM (276,480 bits) for buffering, state storage, and local data processing.
  • I/O Count
    119 I/O pins to support a wide range of peripheral connections and interface requirements.
  • Power
    Core voltage supply range of 1.425 V to 1.575 V for stable supply-level planning.
  • Package & Mounting
    256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount configuration for space-constrained board designs.
  • Temperature & Grade
    Military-grade device with operating temperature from –55°C to 100°C suitable for demanding environmental conditions.
  • RoHS Compliance
    RoHS compliant to support regulatory requirements for material content.

Typical Applications

  • Military and Aerospace Systems
    Military-grade construction and extended temperature range support deployment in avionics, defense electronics, and other mission-critical hardware.
  • Rugged Embedded Controllers
    Compact 256-LBGA packaging and surface-mount mounting make this FPGA a fit for embedded controllers operating in harsh environments.
  • Custom Logic and Signal Processing
    High logic density and on-chip RAM enable implementation of application-specific processing, protocol bridging, and control logic.

Unique Advantages

  • High Logic Density: 38,400 logic elements and 1,500,000 gates provide significant on-chip resources for complex designs without external logic.
  • On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces reliance on external memory for intermediate storage and buffering.
  • Robust Environmental Range: Military grade rating and –55°C to 100°C operating range support long-term operation in challenging conditions.
  • Compact, Board-Friendly Package: 256-LBGA (256-FPBGA, 17×17) surface-mount package conserves PCB area while offering substantial I/O capacity.
  • Controlled Core Voltage: Narrow supply window (1.425 V to 1.575 V) simplifies power-rail design and voltage regulation planning.
  • Regulatory Compliance: RoHS compliance assists with regulatory and material-conformance requirements.

Why Choose AFS1500-FGG256K?

The AFS1500-FGG256K positions itself as a compact, military-grade FPGA solution offering a balance of logic capacity, embedded memory, and extended temperature performance from Microchip Technology. Its combination of 38,400 logic elements, substantial gate count, and on-chip RAM supports a wide range of custom digital functions while the 119 I/O count and 256-LBGA packaging address space-constrained board designs.

This device is suited for engineering teams designing rugged embedded systems, defense electronics, and other applications that require stable operation across a wide thermal range and adherence to RoHS material standards.

Request a quote or submit an inquiry to obtain pricing and availability for the AFS1500-FGG256K and to discuss your project requirements.

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