AFS1500-FGG256K
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA |
|---|---|
| Quantity | 1,075 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Military | Operating Temperature | -55°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 119 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of AFS1500-FGG256K – 119 I/O, 256-LBGA Fusion® FPGA
The AFS1500-FGG256K is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 256-LBGA surface-mount package. It integrates 38,400 logic elements, 1,500,000 gates and approximately 0.276 Mbits of on-chip RAM to implement custom digital logic in a compact form factor.
Designed for applications that require a military-grade component and extended temperature operation, this device supports a core supply range of 1.425 V to 1.575 V and an operating range of –55°C to 100°C, making it suitable for harsh-environment embedded designs.
Key Features
- Logic Capacity
Provides 38,400 logic elements (logic cells) and 1,500,000 gates to implement complex custom logic and control functions. - Embedded Memory
Contains approximately 0.276 Mbits of on-chip RAM (276,480 bits) for buffering, state storage, and local data processing. - I/O Count
119 I/O pins to support a wide range of peripheral connections and interface requirements. - Power
Core voltage supply range of 1.425 V to 1.575 V for stable supply-level planning. - Package & Mounting
256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount configuration for space-constrained board designs. - Temperature & Grade
Military-grade device with operating temperature from –55°C to 100°C suitable for demanding environmental conditions. - RoHS Compliance
RoHS compliant to support regulatory requirements for material content.
Typical Applications
- Military and Aerospace Systems
Military-grade construction and extended temperature range support deployment in avionics, defense electronics, and other mission-critical hardware. - Rugged Embedded Controllers
Compact 256-LBGA packaging and surface-mount mounting make this FPGA a fit for embedded controllers operating in harsh environments. - Custom Logic and Signal Processing
High logic density and on-chip RAM enable implementation of application-specific processing, protocol bridging, and control logic.
Unique Advantages
- High Logic Density: 38,400 logic elements and 1,500,000 gates provide significant on-chip resources for complex designs without external logic.
- On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces reliance on external memory for intermediate storage and buffering.
- Robust Environmental Range: Military grade rating and –55°C to 100°C operating range support long-term operation in challenging conditions.
- Compact, Board-Friendly Package: 256-LBGA (256-FPBGA, 17×17) surface-mount package conserves PCB area while offering substantial I/O capacity.
- Controlled Core Voltage: Narrow supply window (1.425 V to 1.575 V) simplifies power-rail design and voltage regulation planning.
- Regulatory Compliance: RoHS compliance assists with regulatory and material-conformance requirements.
Why Choose AFS1500-FGG256K?
The AFS1500-FGG256K positions itself as a compact, military-grade FPGA solution offering a balance of logic capacity, embedded memory, and extended temperature performance from Microchip Technology. Its combination of 38,400 logic elements, substantial gate count, and on-chip RAM supports a wide range of custom digital functions while the 119 I/O count and 256-LBGA packaging address space-constrained board designs.
This device is suited for engineering teams designing rugged embedded systems, defense electronics, and other applications that require stable operation across a wide thermal range and adherence to RoHS material standards.
Request a quote or submit an inquiry to obtain pricing and availability for the AFS1500-FGG256K and to discuss your project requirements.

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