AFS1500-FGG256I

The AFS1500-FGG256I is a Fusion® Field Programmable Gate Array (FPGA) offered in a 256-LBGA surface-mount package. It delivers a programmable logic fabric with 38,400 logic elements, approximately 0.276 Mbits of embedded memory and 119 I/O pins, designed for industrial-grade applications.

With a supply voltage window of 1.425 V to 1.575 V and an operating temperature range from –40 °C to 100 °C, this device targets designs that require on-chip integration of logic, memory and flexible I/O in a compact package.

Key Features

• Core Logic 38,400 logic elements (cells) and approximately 1,500,000 gates provide the programmable resources needed for custom logic implementations.
• Embedded Memory Total on-chip RAM of 276,480 bits (approximately 0.276 Mbits) for local buffering, state machines and small data structures.
• I/O Capacity 119 user-accessible I/O pins support a variety of interfacing options and custom signal arrangements.
• Package and Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17) in a surface-mount form factor for compact board designs.
• Power Supply Narrow core voltage range of 1.425 V to 1.575 V to match system power rails and ensure stable operation within specified limits.
• Temperature and Grade Industrial grade device rated for operation from –40 °C to 100 °C for use in temperature-demanding environments.
• Mounting Surface mount construction suitable for modern PCB assembly processes.
• Regulatory Status RoHS compliant.

Typical Applications

• Industrial Systems — Suited for industrial designs that require programmable logic operating across –40 °C to 100 °C and industrial-grade components.
• Custom I/O Interfaces — 119 I/O pins enable implementation of bespoke interface logic and signal conditioning on-chip.
• Compact Embedded Modules — 256-LBGA surface-mount package supports space-constrained boards and modular designs.
• Embedded Prototyping — Programmable logic and on-chip RAM allow rapid iteration of custom digital designs within an industrial temperature envelope.

Unique Advantages

• Substantial Logic Capacity: 38,400 logic elements and 1,500,000 gates provide room for complex custom logic implementations without external ASICs.
• On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces the need for external buffering components, simplifying the bill of materials.
• Dense I/O Count: 119 I/Os allow flexible interfacing and reduce dependence on external interface chips.
• Industrial Temperature Rating: –40 °C to 100 °C operation supports deployment in harsher thermal environments where extended temperature operation is required.
• Compact, Surface-Mount Package: 256-LBGA (17 × 17 FPBGA) enables small form-factor PCB designs while maintaining robust connectivity.
• RoHS Compliant: Conforms to RoHS requirements for environmental and manufacturing compliance.

Why Choose AFS1500-FGG256I?

The AFS1500-FGG256I positions itself as a programmable logic solution that balances substantial on-chip resources with industrial-grade robustness. Its combination of 38,400 logic elements, embedded memory and 119 I/Os in a compact 256-LBGA footprint makes it suitable for engineers seeking integrated, reconfigurable logic in temperature-demanding environments.

This device is appropriate for development teams and OEMs requiring on-board programmability, moderate embedded memory, and a high I/O count within a surface-mount industrial-grade package, offering a clear path for scalable, reliable designs backed by documented specifications.

Request a quote or submit your requirements to initiate pricing and availability details for the AFS1500-FGG256I.