AFS1500-FG676I

The AFS1500-FG676I is a Fusion® field programmable gate array (FPGA) from Microchip Technology designed for industrial-grade embedded logic applications. It combines a substantial logic resource set with on-chip RAM and extensive I/O in a compact BGA package, making it suitable for designs that require programmable logic, connectivity, and robust operating conditions.

This device supports a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of –40 °C to 100 °C, and is RoHS compliant. Key silicon metrics include 38,400 logic elements, approximately 1.5 million gates, and approximately 0.276 Mbits of embedded memory.

Key Features

• Core Logic 38,400 logic elements providing the primary programmable fabric; approximately 1.5 million gates for implementing complex digital functions.
• On-Chip Memory Approximately 0.276 Mbits of embedded RAM to support buffers, small data tables, and state storage within the FPGA fabric.
• I/O Capacity 252 general-purpose I/O pins to support broad interfacing with external devices and subsystems.
• Package and Mounting 676-BGA package (supplier device package: 676-FBGA, 27 × 27) in a surface-mount form factor for compact board-level integration.
• Power Narrow supply voltage range of 1.425 V to 1.575 V for core operation, enabling predictable power planning on the host board.
• Temperature and Grade Industrial grade device rated for operation from –40 °C to 100 °C to meet elevated environmental requirements.
• Compliance RoHS compliant for regulatory and manufacturing process alignment.

Unique Advantages

• High logic density: 38,400 logic elements and approximately 1.5 million gates enable implementation of sizable custom logic blocks without external ASICs.
• Integrated on-chip memory: Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for small buffers and state machines.
• Extensive I/O count: 252 I/O pins support multiple peripherals and interfaces directly from the FPGA fabric, simplifying board-level routing.
• Industrial temperature rating: –40 °C to 100 °C qualification supports deployment in environments with demanding thermal ranges.
• Compact BGA footprint: 676-BGA (676-FBGA, 27 × 27) balances pin count and board area for dense system designs.
• RoHS compliant: Conforms to common environmental and manufacturing requirements.

Why Choose AFS1500-FG676I?

The AFS1500-FG676I delivers a balanced combination of logic capacity, embedded memory, and high I/O density in an industrial-grade form factor. Its specifications make it suitable for projects that need substantial programmable logic resources alongside robust environmental performance.

Choose this FPGA when your designs require a compact, surface-mount programmable device with defined voltage and temperature ranges, a large I/O complement, and RoHS compliance—providing a stable platform for industrial and embedded system development.

Request a quote for AFS1500-FG676I or submit a purchase inquiry to get pricing and availability information tailored to your project needs.