AFS250-1FG256

The AFS250-1FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a compact 256-LBGA package. It provides 6,144 logic elements, approximately 36,864 bits of on-chip RAM and 114 general-purpose I/Os for moderate-density programmable-logic applications.

Designed for commercial-temperature embedded systems, the device delivers a balanced combination of logic capacity, on-chip memory and I/O count in a surface-mount 256-FPBGA (17×17) package, with a core supply range of 1.425 V to 1.575 V and RoHS compliance.

Key Features

• Core Logic 6,144 logic elements (cells) providing programmable logic resources for custom digital designs and glue-logic integration.
• Embedded Memory 36,864 bits of on-chip RAM to support buffering, small lookup tables and local data storage.
• I/O Capacity 114 I/Os for flexible interfacing with peripherals, sensors and external logic devices.
• Gate Count Approximately 250,000 gates for mapping moderate-complexity digital functions.
• Power Core voltage supply range of 1.425 V to 1.575 V to match system power rails and regulators.
• Package & Mounting Surface-mount 256-LBGA (supplier package: 256-FPBGA, 17×17) for compact board-level integration.
• Operating Range & Grade Commercial temperature grade with operating range 0 °C to 85 °C and RoHS compliance for regulatory, manufacturing and environmental alignment.

Typical Applications

• Custom Digital Logic — Implement application‑specific finite state machines, protocol handlers and glue logic using the device’s logic elements and on-chip RAM.
• I/O Bridging and Protocol Conversion — Use the 114 I/Os to connect and translate between multiple peripheral interfaces on a single device.
• Embedded Control and Prototyping — Deploy as a compact programmable fabric for control functions and functional prototyping within commercial embedded systems.

Unique Advantages

• Compact, high-density package: The 256-LBGA (17×17) footprint enables a small board area for FPGA integration without sacrificing I/O count.
• Balanced logic and memory: 6,144 logic elements and 36,864 bits of RAM provide a practical mix of resources for moderate-complexity designs.
• Generous I/O availability: 114 I/Os allow flexible interfacing to peripherals and external devices, reducing the need for additional interface components.
• Commercial-temperature qualification: Rated for 0 °C to 85 °C operation to meet typical commercial embedded system requirements.
• Controlled supply range: Defined core voltage window (1.425 V–1.575 V) simplifies power-supply planning and regulator selection.
• RoHS compliant: Conforms to environmental and manufacturing supply-chain requirements for lead-free assembly.

Why Choose AFS250-1FG256?

The AFS250-1FG256 positions itself as a commercially graded, mid-density Fusion® FPGA that combines a practical number of logic elements, on-chip RAM and a substantial I/O complement in a compact 256-LBGA package. It is well suited to designers seeking a programmable-logic device for control, interfacing and moderate-complexity digital tasks where board space and I/O flexibility are important.

Backed by Microchip Technology’s Fusion® product family, this device offers a clear upgrade path within the same ecosystem and predictable supply characteristics for product development and production. Its specified voltage range, package format and RoHS compliance make it appropriate for commercial embedded designs requiring reliable programmable logic integration.

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