EP1AGX60CF484C6N
| Part Description |
Arria GX Field Programmable Gate Array (FPGA) IC 229 2528640 60100 484-BBGA |
|---|---|
| Quantity | 937 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 229 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3005 | Number of Logic Elements/Cells | 60100 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2528640 |
Overview of EP1AGX60CF484C6N – Arria GX Field Programmable Gate Array (FPGA), 484‑BBGA
The EP1AGX60CF484C6N is an Arria GX FPGA from Intel designed for mid‑to‑high density logic and high‑speed serial applications. It integrates a 1.2 V logic array architecture with on‑chip embedded memory and rich I/O to support communications, processing, and interface functions.
This commercial‑grade, surface‑mount device is supplied in a 484‑BBGA package and targets applications that require significant logic capacity, multi‑Gbps transceiver support, and flexible I/O in a compact footprint.
Key Features
- Logic Capacity — 60,100 logic elements providing substantial programmable logic for mid‑range FPGA designs.
- Logic Array Blocks — 3,005 logic array blocks for structured implementation of logic and routing.
- Embedded Memory — Approximately 2.53 Mbits of on‑chip RAM for FIFOs, buffers, and data storage.
- I/O Count — 229 general I/O pins to support broad connectivity and multi‑channel interfaces.
- High‑Speed Transceivers — Arria GX family transceivers support clock data recovery up to 3.125 Gbps and are architected for serial protocols such as PCI Express, Gigabit Ethernet, SDI, SerialLite II, XAUI, and Serial RapidIO.
- Clocking and DSP Resources — Architecture includes multiple global and regional clock networks and dedicated high‑speed DSP blocks for multiply and FIR implementations (series‑level feature).
- Power and Supply — Operates from a 1.15 V to 1.25 V core supply range for predictable power planning.
- Package and Mounting — 484‑BBGA surface‑mount package; supplier device package listed as 484‑FBGA (23×23) for board‑level planning.
- Environmental and Grade — Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- High‑Speed Communication Interfaces — Implement multi‑Gbps serial links and protocol bridging using the integrated transceiver capabilities.
- Networking and Infrastructure — Packet processing, protocol conversion, and interface aggregation where significant logic and abundant I/O are required.
- Video and Broadcast Systems — Support for SDI and other serial video protocols with on‑chip memory for buffering and alignment.
- Signal Processing and Acceleration — Use embedded DSP blocks and on‑chip RAM for acceleration of FIR filters, MAC operations, and data streaming tasks.
Unique Advantages
- Substantial Logic Density: 60,100 logic elements enable complex custom logic and state machines without external glue logic.
- Integrated High‑Speed SerDes: Transceiver support to 3.125 Gbps simplifies high‑bandwidth link implementation and reduces external PHY requirements.
- Generous On‑Chip Memory: Approximately 2.53 Mbits of embedded RAM supports FIFOs, buffering, and multi‑clock domain data handling.
- Wide I/O Count: 229 I/Os accommodate multiple external interfaces and parallel buses in a single device.
- Board‑Level Friendly Package: 484‑BBGA (484‑FBGA, 23×23) surface‑mount package balances pin density and PCB routing for compact systems.
- Commercial Temperature and RoHS Compliance: Suitable for general electronics and systems requiring standard commercial temperature operation and lead‑free manufacturing.
Why Choose EP1AGX60CF484C6N?
The EP1AGX60CF484C6N positions itself as a versatile mid‑density Arria GX FPGA combining significant logic resources, embedded memory, and wide I/O alongside series‑level high‑speed transceiver support. It is suited for designers who need a balance of programmable logic capacity and serial communications capability in a commercial‑grade package.
Choose this device when your design requires integrated memory and DSP resources, extensive I/O, and multi‑Gbps serial links, while operating within a 0 °C to 85 °C commercial temperature window and a 1.15 V–1.25 V core supply domain.
If you would like pricing, availability, or a custom quantity quote for EP1AGX60CF484C6N, request a quote or submit an inquiry and our team will respond with details tailored to your requirements.

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