EP1AGX50DF780I6N

The EP1AGX50DF780I6N is an Intel Arria GX family Field Programmable Gate Array (FPGA) supplied in a 780-ball BGA package. It combines a high-density logic array with on-chip embedded memory and a large I/O count to address demanding communications, video, and signal-processing applications.

As an Arria GX device, the part leverages the family architecture—including high-speed transceiver support and TriMatrix memory architecture—while offering industrial temperature range and RoHS compliance for robust deployments.

Key Features

• Logic Density  50,160 logic elements provide substantial gate capacity for complex FPGA implementations.
• Embedded Memory  Approximately 2.48 Mbits of on-chip RAM (2,475,072 bits) for FIFOs, buffer storage, and local data buffering.
• I/O Resources  350 I/O pins support a wide variety of external interfaces and board-level connectivity.
• Supply Voltage  Core supply specified between 1.15 V and 1.25 V to match Arria GX logic operating requirements.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for reliable performance across harsh environments.
• Package & Mounting  780-ball BGA package; supplier lists package as 780-FBGA (29×29). Surface-mount device for standard board assembly.
• Compliance  RoHS-compliant construction for regulatory and environmental compatibility.
• Arria GX Family Capabilities  Family-level features include high-speed serial transceivers with clock data recovery (up to 3.125 Gbps), TriMatrix multi-size RAM blocks, dedicated high-speed DSP blocks, and up to four enhanced PLLs for flexible clocking (features described in Arria GX device documentation).

Typical Applications

• High-speed serial networking  Implement PCI Express, Gigabit Ethernet, XAUI, or Serial RapidIO interfaces using Arria GX family transceiver capabilities.
• Video and broadcast systems  Support for SDI and related serial video protocols makes the device suitable for video transport and processing pipelines.
• Signal processing and DSP  On-chip DSP resources and abundant logic elements enable FIR filters, multiply–accumulate pipelines, and other real-time signal-processing tasks.
• Memory interface controllers  Support for high-speed external memory (DDR / DDR2) interfaces and local RAM blocks for buffering and data staging.
• Custom serial IP and protocol bridging  High-speed SERDES and programmable logic allow development of proprietary serial protocols and protocol converters.

Unique Advantages

• High-density logic and memory: 50,160 logic elements paired with approximately 2.48 Mbits of embedded RAM reduce external component needs and simplify board design.
• Large, flexible I/O: 350 I/O pins enable diverse peripheral and bus connectivity without extensive multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environments.
• Arria GX family feature set: Access to family-level transceiver architecture, TriMatrix RAM structure, DSP blocks, and enhanced PLLs for advanced interface and signal-processing designs.
• Compact BGA package: 780-ball FBGA footprint (29×29) provides high I/O and signal density in a surface-mount form factor suitable for compact systems.
• Regulatory readiness: RoHS-compliant construction aligns with environmental and manufacturing requirements.

Why Choose EP1AGX50DF780I6N?

The EP1AGX50DF780I6N positions itself as a high-density, industrial-grade Arria GX FPGA option for designs that require a combination of substantial logic capacity, significant embedded memory, and large I/O capability. Its Arria GX family architecture brings proven serial-transceiver and DSP-oriented features for communications, video, and signal-processing systems.

Choose this device when your design demands a scalable FPGA platform with industrial thermal range, compact BGA packaging, and the on-chip resources to reduce external components and streamline system architecture.

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