EP1AGX50DF1152I6N
| Part Description |
Arria GX Field Programmable Gate Array (FPGA) IC 514 2475072 50160 1152-BBGA |
|---|---|
| Quantity | 792 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA | Number of I/O | 514 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2508 | Number of Logic Elements/Cells | 50160 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2475072 |
Overview of EP1AGX50DF1152I6N – Arria GX Field Programmable Gate Array (FPGA) IC 514 2475072 50160 1152-BBGA
The EP1AGX50DF1152I6N is an Intel Arria GX family FPGA in a 1152-ball BGA package designed for industrial applications. It delivers a substantial logic capacity (50,160 logic elements), extensive I/O (514 pins) and approximately 2.475 Mbits of embedded memory, making it suitable for high-throughput, compute- and I/O‑intensive designs.
As part of the Arria GX device family, this device is built on architecture that supports high-speed serial transceiver technology and dedicated DSP and memory resources, providing a platform for communications, video and advanced embedded processing tasks while operating over an industrial temperature range.
Key Features
- Logic Capacity — 50,160 logic elements to implement complex custom logic, state machines and control fabrics.
- Embedded Memory — Approximately 2.475 Mbits of on-chip RAM for FIFOs, buffers and local data storage.
- High I/O Count — 514 user I/O pins to support wide external bus interfaces and multiple peripheral connections.
- Arria GX Family Transceiver and Architecture Features — Family-level features include high-speed serial transceivers with CDR and SERDES, TriMatrix block RAM architecture, dedicated DSP blocks, and multiple PLLs for flexible clocking (family characteristics described in the Arria GX device handbook).
- Package and Mounting — 1152-BBGA package case; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for PCB assembly.
- Power — Core supply specified between 1.15 V and 1.25 V.
- Industrial Temperature Range — Rated for operation from −40°C to 100°C, suitable for industrial environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High-Speed Communications — Leverage the Arria GX family’s serial transceiver and SERDES capabilities for protocol bridging, packet processing and line-rate interfacing.
- Video and Broadcast Systems — Large logic capacity and on-chip memory support video framing, buffering and real-time processing tasks.
- Signal Processing and Acceleration — Embedded memory and DSP-oriented architecture enable filtering, FFTs and other compute-intensive streaming algorithms.
- Industrial Control and Instrumentation — Industrial temperature rating and extensive I/O are well suited for robust control, monitoring and data acquisition systems.
Unique Advantages
- Balanced Logic and Memory — 50,160 logic elements paired with approximately 2.475 Mbits of RAM provide a strong on-chip resource mix for mixed control and data-path designs.
- High I/O Integration — 514 I/O pins reduce external bridging and simplify board-level connectivity for complex systems.
- Industry-Proven Family Features — Built on the Arria GX device family architecture, providing access to transceiver, DSP and memory architectures described in the device handbook.
- Industrial Reliability — Specified for −40°C to 100°C operation and RoHS compliant for deployment in industrial environments.
- Flexible Packaging — 1152-ball BGA footprint compatible with standard surface-mount PCB manufacturing processes.
Why Choose EP1AGX50DF1152I6N?
The EP1AGX50DF1152I6N combines substantial logic density, significant embedded memory and a high pin count in a robust industrial-temperature package. It is suited for designers who need FPGA resources for high-throughput communications, real-time signal processing and sophisticated control applications while maintaining industrial operating margins.
Backed by the Arria GX device family documentation and Intel manufacturing, this part offers a clear specification set—logic capacity, memory size, I/O count, supply range and temperature rating—that helps teams evaluate fit for medium- to high-complexity embedded and communications designs.
If you would like pricing, availability or a formal quote for EP1AGX50DF1152I6N, submit a request or inquiry and include your required quantity and delivery timeframe so our team can respond with current lead time and pricing information.

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