EP1AGX50DF780C6N

IC FPGA 350 I/O 780FBGA
Part Description

Arria GX Field Programmable Gate Array (FPGA) IC 350 2475072 50160 780-BBGA

Quantity 541 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGANumber of I/O350Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2508Number of Logic Elements/Cells50160
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2475072

Overview of EP1AGX50DF780C6N – Arria GX FPGA, 50,160 logic elements, 350 I/O, 780-BBGA

The EP1AGX50DF780C6N is an Intel Arria GX field-programmable gate array (FPGA) in a 780-ball BGA package designed for commercial temperature applications. This device delivers 50,160 logic elements, approximately 2.475 Mbits of embedded memory, and 350 general-purpose I/O pins, making it suitable for mid‑to‑high integration designs that require programmable logic, on‑chip memory and flexible I/O.

As a member of the Arria GX family, it targets designs that leverage high‑speed serial interfaces, DSP resources and extensive clocking options, while operating from a 1.15 V to 1.25 V core supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity — 50,160 logic elements for implementing complex custom logic and control functions.
  • Embedded Memory — Approximately 2.475 Mbits of on‑chip RAM for packet buffering, FIFOs and embedded data storage; Arria GX family TriMatrix memory architecture supports a mix of RAM block sizes.
  • I/O and Interfaces — 350 I/O pins and family-level support for numerous single‑ended and differential I/O standards, enabling broad interface flexibility.
  • High‑Speed Transceiver Support (family) — Arria GX devices include high‑speed serial transceivers with clock-data recovery support up to 3.125 Gbps and device options with 4, 8 or 12 channels for serial protocols and link aggregation.
  • Clocking and Timing — Up to four enhanced PLLs (family) and up to 16 global clock networks with regional clocking to simplify clock distribution and domain crossing.
  • DSP and Performance Blocks (family) — Integrated high‑speed DSP blocks for multiply, MAC and FIR implementations to accelerate signal processing tasks.
  • Package and Power — Surface‑mount 780‑BBGA package (supplier device package: 780‑FBGA, 29×29 mm) and a core voltage supply range of 1.15 V to 1.25 V.
  • Commercial Operating Range — Rated for 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • High‑Speed Networking — Implement protocol handling, packet processing and interconnect logic using the device’s large logic fabric and family transceiver capabilities.
  • Video and Broadcast Interfaces — Support SDI and other serial video links using Arria GX family serial transceiver features and on‑chip memory for buffering.
  • Storage and Host Interfaces — Use programmable logic and I/O resources for protocol bridging, PCI Express endpoint/control and custom host interfaces (family protocols documented in the device handbook).
  • Signal Processing and DSP — Leverage integrated DSP blocks and embedded memory for FIR filters, multiply‑accumulate operations and real‑time data processing.

Unique Advantages

  • Substantial Logic Density: 50,160 logic elements provide the capacity to consolidate multiple discrete functions into a single programmable device, reducing board complexity.
  • Embedded Memory for Low‑Latency Buffers: Approximately 2.475 Mbits of on‑chip RAM support FIFOs, packet buffering and memory‑intensive algorithms without immediate reliance on external memory.
  • Flexible I/O Count: 350 I/O pins enable connectivity to a wide range of peripherals and bus standards, simplifying integration with system components.
  • Family Proven Serial Capabilities: Arria GX family transceivers and SERDES features provide a documented foundation for implementing high‑speed serial links and protocol IP.
  • Compact BGA Packaging: 780‑ball BGA (780‑FBGA, 29×29) delivers high pin count in a compact footprint for space‑constrained designs.
  • Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant to meet common commercial product requirements.

Why Choose EP1AGX50DF780C6N?

The EP1AGX50DF780C6N combines a sizeable logic fabric, significant embedded memory and a high pin‑count package to address mid‑range FPGA applications that require programmable performance and flexible I/O. As part of the Intel Arria GX family, the device benefits from comprehensive device documentation covering transceivers, architecture, configuration and timing that helps accelerate development and validation.

This device is well suited for design teams implementing networking, video, storage or signal‑processing functions who need a commercially rated FPGA with integrated DSP resources and family-level support for high‑speed serial interfaces.

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