EP1AGX60DF780I6N

IC FPGA 350 I/O 780FBGA
Part Description

Arria GX Field Programmable Gate Array (FPGA) IC 350 2528640 60100 780-BBGA

Quantity 423 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGANumber of I/O350Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3005Number of Logic Elements/Cells60100
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2528640

Overview of EP1AGX60DF780I6N – Arria GX Field Programmable Gate Array (FPGA) IC 350 2528640 60100 780-BBGA

The EP1AGX60DF780I6N is an Arria GX family FPGA in a 780-ball BGA package designed for industrial applications requiring programmable logic with integrated high-speed serial capabilities. It pairs a 1.2‑V logic array architecture with approximately 2.53 Mbits of embedded memory and 60,100 logic elements to implement complex control, signal-processing, and protocol-handling functions.

With support for high-density I/O (350 pins), configurable transceiver functionality from the Arria GX family, and a wide supply and temperature range, this device is positioned for network, video, and high‑performance embedded processing designs that demand integration and flexibility.

Key Features

  • Logic Capacity — 60,100 logic elements, suitable for substantial FPGA designs and complex custom logic integration.
  • Embedded Memory — Approximately 2.53 Mbits of on-chip RAM for FIFOs, buffers, and temporary storage to support performance-critical datapaths.
  • High‑Speed I/O & Transceivers — Family-level Arria GX transceiver architecture includes CDR-equipped SERDES with support for common serial protocols and high-speed serial links.
  • I/O Count & Standards — 350 I/O pins with support for numerous single-ended and differential standards, enabling diverse interfacing options.
  • Clocking & DSP — Arria GX family features multi‑PLL clocking (up to four enhanced PLLs) and high-speed DSP blocks for multiply-accumulate and FIR implementations.
  • Memory Architecture — TriMatrix RAM architecture with multiple RAM block sizes for dual-port memory and FIFO implementations, with internal performance up to the family‑specified rates.
  • Power & Supply — Operates from a supply range of 1.15 V to 1.25 V, enabling integration into standard 1.2 V FPGA power rails.
  • Package & Mounting — 780‑BBGA package (supplier package: 780‑FBGA, 29×29) with surface-mount mounting for compact board integration.
  • Industrial Grade & Temperature — Industrial grade device rated for operation from −40 °C to 100 °C.
  • Compliance — RoHS‑compliant manufacturing status.
  • IP & Configuration Support — Arria GX family supports Altera MegaCore IP and AMPP megafunctions and features for remote configuration and established protocol megafunctions.

Typical Applications

  • Networking & Communications — Protocol offload, packet processing, and high-speed link interfacing where integrated transceivers and abundant I/O simplify board design.
  • Video & Broadcast — SDI and other serial video protocol bridging and processing using the family’s SERDES and dedicated protocol support.
  • High‑Performance Embedded Systems — DSP-heavy signal processing and algorithm acceleration leveraging on-chip DSP blocks and plentiful logic elements.
  • Storage & Interface Controllers — Implement controllers and protocol bridges that require flexible I/O standards and on-chip memory for buffering.

Unique Advantages

  • Integrated Serial Protocol Support: Family-level SERDES with CDR and protocol megafunction support reduces external chipset needs for high‑speed links.
  • Balanced Logic and Memory: 60,100 logic elements coupled with approximately 2.53 Mbits of embedded RAM provide a balance suited to complex control and buffering tasks.
  • Flexible Clocking and DSP: Enhanced PLLs and dedicated DSP blocks enable stable, high-performance signal processing and clock-domain management.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation and RoHS compliant, appropriate for industrial environments.
  • High I/O Density: 350 I/O pins allow interfacing to a wide range of peripherals and high-speed external memory or transceiver connections.
  • Compact Packaging: 780‑BBGA (29×29 FBGA supplier package) provides a high‑pin count solution in a compact surface‑mount form factor.

Why Choose EP1AGX60DF780I6N?

The EP1AGX60DF780I6N delivers a mid-to-high density Arria GX FPGA option that combines sizable logic capacity, multi-megabit embedded memory, and family-level high-speed transceiver capabilities in a single industrial-grade package. It is well suited for designs that require integrated serial protocol handling, significant on-chip processing, and flexible I/O options.

Designers benefit from the Arria GX family’s megafunction IP support, diverse clocking and DSP resources, and a package optimized for board-level density. The device is appropriate for network, video, and embedded signal-processing customers seeking a scalable, programmable platform with industrial operating range.

If you would like pricing, availability, or a formal quote for EP1AGX60DF780I6N, submit a request to receive a sales quotation or additional technical information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up