EP1C6Q240C7N

The EP1C6Q240C7N is an Intel Cyclone® family Field Programmable Gate Array (FPGA) offered in a 240-pin BFQFP package. It provides 5,980 logic elements and approximately 92 Kbits of embedded RAM, delivering a balanced mix of logic density and on-chip memory for cost-conscious data-path and control applications.

Designed for commercial-temperature deployments, this Cyclone device supports flexible I/O and clocking resources while operating from a VCC supply range of 1.425 V to 1.575 V, making it suitable for embedded systems, communications interfaces, and general-purpose FPGA-based designs.

Key Features

• Logic Capacity  5,980 logic elements for implementing combinational and sequential logic, state machines, and glue logic.
• Embedded Memory  Approximately 92 Kbits of on-chip RAM (92,160 bits) to support buffering, FIFOs, and small data structures without external memory.
• I/O Resources  Up to 185 user I/O pins to interface with peripherals, sensors, memory devices, and system buses.
• Clocking  Device-level support includes up to two PLLs as part of the Cyclone family architecture for clock multiplication and phase control.
• Package  240-BFQFP (240-PQFP, 32 × 32 mm footprint) surface-mount package for PCB assembly in compact form factors.
• Power Supply  Core voltage specified between 1.425 V and 1.575 V to match system power rails and enable predictable power budgeting.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards and Compatibility  Part of the Cyclone family, which supports common interface standards and memory interfaces as described in Cyclone device documentation.
• RoHS Compliant  Meets RoHS requirements for hazardous-substance reduction.

Typical Applications

• Data-path Processing  Hardware acceleration and custom data-flow logic where moderate logic density and on-chip RAM are required.
• Interface Bridging  Protocol glue and bus interfacing using the available 185 I/O pins to connect ASSPs, memory, and peripheral devices.
• Embedded Control  Control logic, state machines, and I/O aggregation in commercial embedded products operating within 0 °C to 85 °C.
• Memory Buffering  Small FIFOs and temporary storage implemented using the on-chip RAM for latency-sensitive buffering tasks.

Unique Advantages

• Balanced Logic-to-Memory Ratio:  5,980 logic elements paired with ~92 Kbits of RAM supports mixed compute-and-buffer designs without immediate external memory needs.
• Ample I/O Count:  185 user I/O pins enable direct interfacing to a wide range of peripherals and parallel buses, reducing the need for external I/O expanders.
• Compact Surface-Mount Package:  240-BFQFP footprint provides a space-efficient option for PCB layouts while maintaining accessibility to a high pin count.
• Predictable Power Envelope:  A documented core voltage range (1.425 V–1.575 V) facilitates power-supply planning and thermal management in system design.
• Commercial Temperature Suitability:  Rated for 0 °C to 85 °C operation, appropriate for a wide range of commercial and industrial-adjacent applications.
• RoHS Compliance:  Meets environmental restrictions for hazardous substances, simplifying regulatory and supply-chain considerations.

Why Choose EP1C6Q240C7N?

The EP1C6Q240C7N delivers a practical balance of logic capacity, embedded memory, and I/O flexibility in a compact 240-BFQFP package. Its combination of 5,980 logic elements, approximately 92 Kbits of on-chip RAM, and up to 185 I/O pins makes it well suited for designers implementing data-path functions, custom interfaces, and embedded control logic within commercial temperature ranges.

As a Cyclone family device, it integrates essential clocking resources and a documented operating voltage range to simplify system integration and provide a predictable platform for scalable FPGA-based designs.

Request a quote or submit an inquiry to receive pricing and availability for the EP1C6Q240C7N. Technical and procurement teams can use the provided specifications to evaluate fit for upcoming designs and BOM planning.