EP1C6Q240I7

The EP1C6Q240I7 is an Intel Cyclone® series FPGA offering a balanced combination of logic capacity, embedded memory, and flexible I/O in a 240-pin PQFP surface-mount package. It targets data-path and interface-focused designs that require a mid-range FPGA fabric with industrial temperature capability.

Built on the Cyclone device architecture, this device is suitable for applications requiring up to 5,980 logic elements, approximately 92,160 bits of on-chip RAM, and up to 185 user I/O pins while operating across an extended industrial temperature range.

Key Features

• Logic Capacity  Provides 5,980 logic elements to implement medium-complexity control, processing, and glue-logic functions.
• Embedded Memory  Approximately 92,160 bits of on-chip RAM for buffering, small FIFOs, and tables within the FPGA fabric.
• I/O Density and Standards  Up to 185 user I/O pins to support multiple interfaces; Cyclone family devices support common I/O standards suitable for interfacing with ASSP and ASIC devices.
• Clocking  Includes device-level PLL resources (two PLLs for the EP1C6 device class) to support clock multiplication and phase shifting.
• Power and Voltage  Core supply range specified from 1.425 V to 1.575 V to support stable low-voltage operation.
• Package and Mounting  240-BFQFP (supplier device package 240-PQFP, 32×32 mm) in a surface-mount format for compact board designs.
• Industrial Grade  Rated for operation from -40 °C to 100 °C, suitable for industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• Data-path processing  Use the FPGA fabric and on-chip RAM for mid-range data-flow and packet processing tasks where deterministic, hardware-accelerated logic is required.
• Memory interface and buffering  Integrate DDR/SDR memory controllers or FCRAM interfaces with the available PLLs and embedded RAM for temporary data buffering and timing alignment.
• Peripheral and bus bridging  Implement 66-/33-MHz PCI bridging, glue logic, and custom peripheral interfaces leveraging the device’s I/O density and supported interface standards.
• High-speed I/O links  Deploy LVDS and other supported I/O standards for medium-rate serial links and inter-device communication.

Unique Advantages

• Balanced logic and memory  5,980 logic elements combined with ~92 kbits of embedded RAM let you implement control, state machines, and moderate buffering without external memory for many designs.
• Flexible I/O pin count  Up to 185 user I/O pins provide the pin availability needed for multi-interface designs and board-level consolidation.
• Industrial temperature rating  -40 °C to 100 °C operation supports deployment in temperature-demanding industrial applications.
• Compact surface-mount package  240-PQFP (32×32) allows integration into space-constrained PCBs while retaining broad I/O access.
• Low-voltage core  Core supply specified at 1.425 V–1.575 V supports modern low-power board power architectures.
• RoHS compliant  Meets lead-free manufacturing requirements for modern electronics production.

Why Choose EP1C6Q240I7?

The EP1C6Q240I7 positions itself as a mid-density Cyclone FPGA that brings together nearly 6k logic elements, substantial on-chip RAM, and a broad set of I/O in a compact PQFP package rated for industrial temperatures. It is well suited to engineers designing data-path interfaces, memory controllers, bus bridges, and medium-complexity embedded logic who need a reliable, RoHS-compliant programmable device.

For teams seeking a scalable Cyclone-based option that balances integration, I/O flexibility, and thermal robustness, the EP1C6Q240I7 delivers practical resources for cost-conscious designs while supporting a range of interface and timing requirements through its PLL resources and I/O capabilities.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EP1C6Q240I7.