EP1C6T144C6N

IC FPGA 98 I/O 144TQFP
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 98 92160 5980 144-LQFP

Quantity 896 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O98Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs598Number of Logic Elements/Cells5980
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits92160

Overview of EP1C6T144C6N – Cyclone® Field Programmable Gate Array (FPGA) IC, 98 I/O, 5980 Logic Elements, 144‑LQFP

The EP1C6T144C6N is an Intel Cyclone® family FPGA supplied in a 144‑lead LQFP package. This commercial‑grade device provides 5,980 logic elements and approximately 0.09 Mbits of on‑chip RAM, making it suitable for mid‑range embedded and data‑path applications.

Built on the Cyclone architecture, the device supports common memory and I/O interfaces used in system designs and offers a compact surface‑mount package, a tightly specified core voltage range, and commercial operating temperature support for general-purpose electronics.

Key Features

  • Core Logic  5,980 logic elements for implementing mid‑level combinational and sequential logic functions.
  • Embedded Memory  Approximately 0.09 Mbits (92,160 bits) of on‑chip RAM to support buffering, small FIFOs, and local data storage.
  • I/O  98 user I/O pins provided in the 144‑lead package, enabling multiple peripheral and sensor connections.
  • Clocking  Device family documentation indicates availability of up to two PLLs for clock multiplication and phase shifting in Cyclone EP1C6 devices.
  • Package & Mounting  144‑lead LQFP package (supplier package listed as 144‑TQFP, 20×20 mm) in a surface‑mount form factor for compact PCB designs.
  • Power  Core supply specified at 1.425 V to 1.575 V for predictable power budgeting and regulator selection.
  • Operating Range  Commercial grade: 0 °C to 85 °C operating temperature.
  • Compliance  RoHS compliant.

Typical Applications

  • Data‑path processing  Implements mid‑level datapath logic where moderate logic capacity and embedded RAM are required for temporary storage and buffering.
  • Memory interface controllers  Supports designs that connect to external memories; Cyclone family documentation references DDR SDRAM and other external memory support for memory interface implementations.
  • Peripheral bridging and protocol handling  Used to implement custom peripheral interfaces and protocol conversion between ASSPs/ASICs and system peripherals.
  • Embedded control and glue logic  Acts as a compact programmable controller or glue logic element in commercial‑grade embedded systems.

Unique Advantages

  • Right‑sized logic density: 5,980 logic elements match mid‑range design complexity without the cost or board area of larger devices.
  • On‑chip RAM availability: Approximately 0.09 Mbits of embedded memory reduces dependence on small external RAM for control, buffering, and lookup tables.
  • Compact surface‑mount package: 144‑lead LQFP/TQFP (20×20 mm) provides a balance of pin count and PCB footprint for space‑constrained designs.
  • Predictable power domain: Narrow core voltage window (1.425 V–1.575 V) simplifies power supply selection and thermal planning.
  • Commercial operating range: Rated for 0 °C to 85 °C for general‑purpose commercial electronics deployment.
  • RoHS compliant: Meets lead‑free manufacturing requirements for regulatory compliance and modern assembly flows.

Why Choose EP1C6T144C6N?

The EP1C6T144C6N positions itself as a practical Cyclone family member for mid‑complexity FPGA projects where a compact package, moderate logic capacity, and on‑chip RAM are sufficient. Its defined core voltage range, surface‑mount 144‑lead package, and commercial temperature rating make it a straightforward choice for embedded system designers focused on cost and PCB area efficiency.

For designs that may migrate within the Cyclone family, the Cyclone device handbook documents vertical migration strategies across densities and packages—supporting long‑term design scalability and reuse within the same FPGA family and footprint considerations.

If you would like pricing, availability, or to request a formal quote for EP1C6T144C6N, submit a quote request or sales inquiry with your quantity and delivery requirements.

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