EP1C6Q240C7

IC FPGA 185 I/O 240QFP
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 240-BFQFP

Quantity 1,875 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 85°C
Package / Case240-BFQFPNumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs598Number of Logic Elements/Cells5980
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits92160

Overview of EP1C6Q240C7 – Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 240-BFQFP

The EP1C6Q240C7 is a Cyclone® family FPGA offering a balanced combination of logic, embedded memory and I/O for commercial embedded and data-path applications. It is based on the Cyclone architecture described in the device handbook and is implemented on a 1.5‑V, 0.13‑µm, all-layer copper SRAM process.

With 5,980 logic elements, approximately 92 Kbits of embedded memory and 185 user I/O pins in a 240‑pin PQFP form factor, this device is targeted at designers requiring mid-range programmable logic for interface bridging, memory control and general-purpose digital processing within a commercial temperature range.

Key Features

  • Logic Capacity — 5,980 logic elements provide mid-range programmable logic resources for control, glue-logic and data-path functions.
  • Embedded Memory — Approximately 92 Kbits of on-chip RAM suitable for small buffering, FIFOs and state storage.
  • I/O and Interfaces — 185 user I/O pins enable broad connectivity; the Cyclone family supports multiple I/O standards and high-speed LVDS signalling as described in the device handbook.
  • Clocking Resources — Device-level support for up to two PLLs for clock multiplication and phase adjustment as documented for the Cyclone family.
  • Package and Mounting — 240‑pin BFQFP package (supplier device package listed as 240‑PQFP, 32×32) in a surface-mount package for PCB integration.
  • Power — Core supply operating range of 1.425 V to 1.575 V consistent with the Cyclone device family process requirements.
  • Commercial Grade — Rated for 0 °C to 85 °C operation and specified as commercial grade.
  • Standards and Configuration — Cyclone devices support common memory interfaces (including DDR SDRAM) and peripheral standards such as 66‑ and 33‑MHz PCI in the family documentation; configuration options include low-cost serial configuration devices.
  • RoHS Compliant — Device is compliant with RoHS environmental requirements.

Typical Applications

  • Data-Path Processing — Mid-range logic and on-chip RAM suited for packet processing, signal routing and data-path control functions.
  • Memory Interface Bridging — Used to implement DDR SDRAM and SDRAM interface logic and buffering as supported by the Cyclone family.
  • High-Speed I/O and Protocol Bridging — Ideal for implementing LVDS links, PCI-compatible peripheral interfaces or other multi-standard I/O bridging tasks.
  • Embedded Control and Prototyping — Provides reconfigurable logic for control paths, user interfaces and development platforms within a commercial temperature environment.

Unique Advantages

  • Balanced Integration: Combines nearly 6,000 logic elements with embedded RAM and extensive I/O to reduce external component count and simplify board design.
  • Flexible I/O Support: Family-level support for multiple I/O standards and high-speed LVDS enables broad interface compatibility and system-level flexibility.
  • On-Die Clocking: Up to two PLLs provide clock multiplication and phase shifting to simplify clock-domain management without additional ICs.
  • Standard Package for Easy Assembly: 240-pin QFP/PQFP surface-mount package fits common PCB assembly flows and supports migration across Cyclone densities in similar packages.
  • Environmentally Compliant: RoHS compliance helps meet regulatory requirements for commercial electronic products.

Why Choose EP1C6Q240C7?

The EP1C6Q240C7 positions itself as a practical, mid-density Cyclone FPGA option for designers who need a mix of logic resources, embedded memory and broad I/O in a commercial-grade, surface-mount package. Its combination of approximately 5,980 logic elements, roughly 92 Kbits of on-chip RAM, 185 I/O pins and family-level support for common memory and interface standards makes it well suited to interface bridging, data-path control and embedded system prototyping.

For product designs that prioritize predictable supply voltage requirements (1.425–1.575 V), available PLL-based clocking and a 240‑pin PQFP footprint, the EP1C6Q240C7 offers a reliable, standards-aligned option backed by the Cyclone device documentation and ecosystem.

Request a quote or submit an inquiry to receive pricing, availability and volume purchase options for the EP1C6Q240C7.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up