EP1C6F256I7

IC FPGA 185 I/O 256FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA

Quantity 804 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs598Number of Logic Elements/Cells5980
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits92160

Overview of EP1C6F256I7 – Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA

The EP1C6F256I7 is an Intel Cyclone® series SRAM-based FPGA in a 256‑FBGA (17×17) surface-mount package designed for mid-range logic and data-path applications. This industrial-grade device delivers 5,980 logic elements, approximately 0.092 Mbits of embedded memory (92,160 bits), and 185 user I/O pins in a compact BGA footprint.

As a member of the Cyclone family, the device benefits from architecture features documented for the series—such as on-chip PLLs and broad I/O standard support—making it suitable for designs that require moderate logic density, embedded memory, and flexible interfacing under industrial temperature conditions.

Key Features

  • Logic Capacity – 5,980 logic elements provide a mid-range programmable fabric for control, signal processing, and glue-logic tasks.
  • Embedded Memory – Approximately 0.092 Mbits of on-chip RAM (92,160 bits) for buffering, FIFOs, and small on-chip datasets.
  • I/O Density – 185 user I/O pins support extensive peripheral interfacing and system-level connectivity.
  • Clocking Resources – Cyclone family documentation includes support for on-chip PLLs (up to two per device), enabling clock multiplication and phase alignment for common data-path uses.
  • Package & Mounting – 256‑FBGA (17×17) package in a surface-mount form factor for compact board designs.
  • Power Supply – Specified core voltage range of 1.425 V to 1.575 V for predictable power-domain planning.
  • Industrial Temperature Rating – Operates from −40 °C to 100 °C, suitable for industrial environments.
  • RoHS Compliant – Meets RoHS requirements for restricted substances.
  • Cyclone Family Capabilities – Series-level support includes multiple I/O standards (for example LVTTL, LVCMOS, SSTL‑2/3), DDR and SDRAM interfacing options, and compatibility with Altera design tools and IP ecosystems as described for the Cyclone family.

Typical Applications

  • Data-Path Processing – Implement intermediate data-path logic, parallel processing blocks, and custom datapaths where mid-range logic density and on-chip memory are required.
  • Memory Interface and Buffering – Use the device for DDR/SDR memory controllers and buffering logic leveraging Cyclone family memory interface support.
  • Industrial Control – Deploy in factory automation and industrial control systems that require an industrial temperature window and flexible I/O connectivity.
  • Embedded System Glue Logic – Integrate custom peripheral interfaces, protocol handling, and timing-critical glue logic with the device’s abundant I/O and clocking resources.

Unique Advantages

  • Balanced Logic and Memory: Combines nearly 6,000 logic elements with on-chip RAM to support a broad set of mid-range FPGA designs without immediate need for external memory in smaller buffering tasks.
  • High I/O Count in a Compact Package: 185 user I/Os in a 256‑FBGA deliver dense connectivity while minimizing PCB footprint.
  • Industrial Reliability: −40 °C to 100 °C operating range and surface-mount BGA packaging meet common industrial deployment requirements.
  • Predictable Power Domain: Narrow core voltage specification (1.425 V–1.575 V) simplifies power-supply design and sequencing.
  • Family-Level Ecosystem: Leverages documented Cyclone family features—PLL clocking, standard memory interfaces, and design tools/IP support—facilitating development and migration within the Cyclone family.

Why Choose EP1C6F256I7?

The EP1C6F256I7 positions itself as a practical, industrial-grade Cyclone FPGA option for designers who need a mid-range balance of logic resources, embedded memory, and substantial I/O in a compact BGA package. Its series-level architecture features and compatibility with Cyclone design ecosystems make it well suited for data-path tasks, memory interfacing, and industrial control applications where predictable thermal and power characteristics matter.

Choose this device when you require a reliable, RoHS-compliant FPGA with a clear specification set for logic capacity, on-chip RAM, I/O count, supply range, and operating temperature to accelerate development and simplify system integration.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EP1C6F256I7.

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