EP1C6F256I7N

The EP1C6F256I7N is an Industrial-grade Cyclone® field-programmable gate array (FPGA) in a 256-ball BGA package. It implements the Cyclone architecture with 5,980 logic elements and approximately 92,160 bits of embedded RAM, targeting data-path and control applications that require flexible logic integration and a mid-range density FPGA.

Designed for embedded and system designers, this device combines a dual-PLL capable Cyclone architecture, a broad I/O count, and industrial temperature range to support a variety of control, interface, and signal-processing tasks in temperature-demanding environments.

Key Features

• Logic Capacity  5,980 logic elements and 598 logic array blocks (LABs) provide mid-range programmable logic resources suitable for glue logic, protocol bridging, and moderate-density custom logic functions.
• Embedded Memory  Approximately 92,160 bits of on-chip RAM support local buffering, FIFOs, and small memory structures for data-path and control logic.
• I/O Density and Standards  185 user I/O pins allow extensive external interfacing. The Cyclone family supports multiple common I/O standards as described in the device handbook.
• Clocking  Up to two PLLs per device (Cyclone family specification) provide on-chip clock multiplication and phase shifting to support varied timing requirements.
• Power and Supply  Nominal device supply specified between 1.425 V and 1.575 V, enabling integration with systems using this core voltage range.
• Package and Mounting  256-ball FineLine BGA (256-FBGA, 17×17) package with surface-mount mounting for high-density board designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Standards and Compliance  RoHS-compliant manufacturing.

Typical Applications

• Industrial Control  Implement real-time control logic, motor drive interfaces, and factory automation glue functions using programmable logic and on-chip memory.
• Communications and Interface Bridging  Create protocol bridges and custom I/O interfaces leveraging the 185 user I/Os and the Cyclone family’s supported I/O standards.
• Embedded System Glue Logic  Replace discrete logic and reduce BOM by consolidating timing, decoding, and peripheral interfacing into a single FPGA.
• Data Path Buffering  Use the device’s embedded RAM and PLLs to implement buffering, FIFOs, and clock-domain crossing for modest bandwidth data-paths.

Unique Advantages

• Balanced Logic and Memory:  5,980 logic elements paired with ~92 Kbits of RAM provide a balanced resource mix for control and moderate data-path tasks.
• Flexible I/O Count:  185 I/Os enable multiple external interfaces without requiring external I/O expander devices, simplifying board-level design.
• On-Chip Clock Management:  Integrated PLL capability supports clock multiplication and phase adjustments, reducing the need for external clocking components.
• Industrial-Grade Operation:  Rated from −40 °C to 100 °C for deployments in thermally challenging industrial environments.
• Compact BGA Packaging:  256-FBGA (17×17) provides a compact footprint for space-constrained PCBs while supporting high pin count and reliable surface-mount assembly.
• Regulatory Compliance:  RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose EP1C6F256I7N?

The EP1C6F256I7N delivers a practical balance of programmable logic, embedded memory, and I/O capacity in an Industrial-grade Cyclone FPGA package. It is well suited for designers needing a mid-density FPGA with on-chip clocking and sufficient I/O to consolidate logic and interface functions on a single device.

This device is aimed at engineering teams developing control systems, protocol bridges, and embedded logic subsystems that require reliable operation across a wide temperature range and a compact BGA footprint for optimized PCB layouts.

Request a quote or submit a procurement inquiry to evaluate EP1C6F256I7N for your next design and to confirm availability, pricing, and lead times.