EP1C6F256C8

IC FPGA 185 I/O 256FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA

Quantity 1,445 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs598Number of Logic Elements/Cells5980
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits92160

Overview of EP1C6F256C8 – Cyclone® Field Programmable Gate Array (FPGA), 185 I/O, ~92,160 bits RAM, 5,980 LEs, 256‑FBGA

The EP1C6F256C8 is a Cyclone® family SRAM-based FPGA from Intel designed for cost-sensitive data-path and logic integration applications. It provides a balance of programmable logic, embedded RAM, and I/O capacity in a compact 256‑FBGA (17×17) surface‑mount package.

Built on the Cyclone architecture, this device targets designs that require moderate logic density and on-chip memory with flexible clocking and I/O options while operating from a 1.425 V to 1.575 V supply over a commercial temperature range.

Key Features

  • Logic Capacity  Approximately 5,980 logic elements to implement custom logic, control, and data-path functions.
  • Embedded Memory  Approximately 92,160 bits of on-chip RAM (organized as 20 M4K RAM blocks) for FIFOs, buffers, and small data stores.
  • I/O Density  Up to 185 user I/O pins, suitable for multi‑lane interfaces, peripheral connections, and mixed-signal board-level integration.
  • Clocking  Two phase-locked loops (PLLs) for clock multiplication and phase shifting to support varied clock domains and timing requirements.
  • Package  256‑FBGA (17×17) surface-mount package provides a compact footprint for space-constrained boards.
  • Power  Core voltage supply range: 1.425 V to 1.575 V, enabling stable device operation within the specified range.
  • Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Standards & Family-Level Support  Part of the Cyclone family which supports memory interfaces and common I/O standards (family-level capabilities include DDR interfaces, LVDS support, and PCI signaling as documented for Cyclone devices).
  • Compliance  RoHS compliant for lead-free assembly and environmental regulatory requirements.

Typical Applications

  • Data‑Path Processing  Implement custom packet processing, data formatting, or protocol bridging using the available logic elements and embedded RAM.
  • Memory Interface Controllers  Build DDR/SDR memory controllers and buffering logic taking advantage of on-chip RAM and the device’s clocking resources.
  • Embedded Control & Glue Logic  Replace multiple discrete components with programmable logic for board-level control, bus interfacing, and peripheral aggregation.
  • Consumer & Industrial Electronics  Use the compact 256‑FBGA package and up to 185 I/Os to integrate user interfaces, sensor aggregation, and peripheral I/O in space-constrained products.

Unique Advantages

  • Balanced Logic and Memory: ~5,980 logic elements combined with ~92,160 bits of embedded RAM (20 M4K blocks) provide room for moderate complexity designs without external memory for many functions.
  • Flexible I/O Count: Up to 185 user I/Os accommodate multi-signal interfaces and board-level integration while keeping a compact package footprint.
  • Compact, Board-Friendly Package: The 256‑FBGA (17×17) surface-mount package enables dense board layouts for compact systems.
  • Dedicated Clocking Resources: Two onboard PLLs allow designers to implement multiple clock domains and perform frequency synthesis within the device.
  • Commercial-Grade Reliability: Defined commercial operating range (0 °C to 85 °C) and RoHS compliance for mainstream electronic products.
  • Proven Cyclone Architecture: Leverages Cyclone family features for memory interfaces and high-speed I/O options, simplifying migration within the family.

Why Choose EP1C6F256C8?

The EP1C6F256C8 delivers a practical combination of logic density, embedded RAM, and I/O capacity in a compact 256‑FBGA package, making it well suited for designers who need programmable, board‑level integration without the overhead of higher-density devices. Its Cyclone family heritage provides familiar architecture and family-level capabilities for memory interfaces and high-speed I/O, while the included PLLs and substantial on‑chip RAM simplify clocking and buffering tasks.

This device is targeted at engineers building cost-conscious data-path, control, and interface solutions in commercial products where a balance of resources, package size, and power requirements is important.

If you would like pricing, lead-time, or availability information for EP1C6F256C8, request a quote or submit an inquiry to our team and we will respond promptly.

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