EP1C6F256C6NGA
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA |
|---|---|
| Quantity | 180 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 185 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 598 | Number of Logic Elements/Cells | 5980 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 92160 |
Overview of EP1C6F256C6NGA – Cyclone® FPGA IC, 5,980 logic elements, ~92,160‑bit RAM, 185 I/O, 256‑FBGA
The EP1C6F256C6NGA is a Cyclone® family field-programmable gate array (FPGA) from Intel. It combines a moderate logic density with on-chip embedded RAM and a high I/O count in a compact 256‑FBGA package for commercial electronic designs.
As part of the Cyclone family—which is based on a 1.5‑V, 0.13‑µm SRAM process and described as a cost‑effective solution for data‑path applications—this device is suited for projects that need balanced logic, on‑chip memory, and flexible I/O in a surface‑mount BGA format.
Key Features
- Logic Capacity Approximately 5,980 logic elements provide a moderate-density fabric for implementing control, glue logic, and custom datapath functions.
- Embedded Memory Approximately 92,160 bits of on‑chip RAM support buffering, small lookup tables, and state storage without external memory.
- I/O Resources 185 user I/O pins accommodate multiple parallel buses, peripheral interfaces, and external device connections.
- Power Supply Specified core voltage range of 1.425 V to 1.575 V for reliable device operation within defined limits.
- Package and Mounting 256‑FBGA (17 × 17) package in a surface‑mount form factor for compact board layouts.
- Operating Range Commercial operating temperature range of 0 °C to 85 °C suitable for standard electronic products and systems.
- Family Capabilities As a Cyclone device, the family supports features such as up to two PLLs for clock multiplication/phase shifting and support for common I/O standards and high‑speed differential I/O modes.
- Regulatory RoHS compliant.
Typical Applications
- Data‑path and signal processing Implement moderate‑complexity datapath logic and buffering using the device’s logic elements and on‑chip RAM for tasks such as packet handling, filtering, and small FIFO buffers.
- Peripheral and bus interfacing Leverage 185 I/O pins to bridge processors and peripherals, interface to parallel buses, or handle multiple control and status signals.
- Control and embedded systems Use the FPGA for custom control logic, state machines, and glue logic in commercial electronic products requiring reconfigurable hardware.
Unique Advantages
- Balanced logic and memory Combines roughly 5,980 logic elements with ~92,160 bits of embedded RAM to handle both combinational logic and on‑chip data storage in a single device.
- High I/O density in a compact package 185 I/O pins in a 256‑FBGA (17 × 17) package let you route multiple interfaces while keeping board area constrained.
- Commercial temperature and RoHS compliance Rated for 0 °C to 85 °C operation and RoHS compliant to meet standard product and regulatory requirements.
- Family ecosystem As part of the Cyclone family, you can leverage documented device-level features such as PLLs and support for a range of I/O standards for flexible clocking and interface options.
- Low-voltage core operation Narrow core voltage spec (1.425 V–1.575 V) supports predictable power design and supply planning.
Why Choose EP1C6F256C6NGA?
The EP1C6F256C6NGA positions itself as a practical, commercially graded FPGA for designers needing moderate logic density, meaningful on‑chip RAM, and a high count of I/O in a small BGA footprint. Its specification set makes it well suited to embedded controllers, interface bridging, and data‑path roles where integration and board‑area efficiency matter.
Choosing this Cyclone‑family device provides predictable electrical and thermal parameters, RoHS compliance, and access to the Cyclone architecture’s clocking and I/O capabilities—delivering a balanced solution for engineers building compact, reconfigurable commercial electronic systems.
If you would like pricing, availability, or to request a formal quote for EP1C6F256C6NGA, please submit a quote request or contact the sales team for assistance.

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