EP1C6F256C7

IC FPGA 185 I/O 256FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA

Quantity 326 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs598Number of Logic Elements/Cells5980
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits92160

Overview of EP1C6F256C7 – Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA

The EP1C6F256C7 is a Cyclone® family SRAM-based FPGA offered in a 256-BGA package designed for commercial applications. It provides a mid-range logic capacity and on-chip memory suitable for data-path and embedded-control designs that require a balance of integration and low-voltage operation.

Built on the Cyclone device architecture, this device targets applications that benefit from configurable logic, embedded RAM, multi-pin I/O and on-device clocking resources while operating within standard commercial temperature and supply ranges.

Key Features

  • Logic Capacity  Approximately 5,980 logic elements for implementing custom logic, glue, and control functions.
  • Embedded Memory  Approximately 0.092 Mbits of on-chip RAM (92,160 total bits) for local buffering and state storage.
  • I/O Resources  Up to 185 user I/O pins to support parallel interfaces, sensor/actuator connections, and external device control.
  • Clocking  Includes up to two PLLs as provided in the Cyclone family for clock multiplication and phase control.
  • Package & Mounting  256-BGA (supplier package: 256-FBGA 17×17) in a surface-mount form factor for compact PCB designs.
  • Power  Operates from a core supply in the range 1.425 V to 1.575 V, enabling low-voltage system architectures.
  • Temperature Grade  Commercial operating range from 0 °C to 85 °C for standard embedded and electronics applications.
  • Compliance  RoHS-compliant device meeting lead-free environmental requirements.

Typical Applications

  • Data-path Processing  Implement custom datapath logic, packet processing, or protocol handling using the device’s logic elements and on-chip RAM.
  • Memory Interfaces  Support for external memory interfaces and buffering tasks that benefit from internal RAM and clocking resources.
  • High-density I/O Control  Drive and monitor numerous parallel signals or peripherals with the device’s 185 user I/O pins in space-constrained designs.
  • Embedded Control and Glue Logic  Replace multiple discrete components by consolidating control, bus bridging, and timing functions into programmable logic.

Unique Advantages

  • Balanced Logic and Memory: Combines approximately 5,980 logic elements with ~92,160 bits of embedded RAM to support mixed logic and buffering requirements.
  • Flexible I/O Count: 185 user I/O pins provide ample connectivity for parallel interfaces, sensor arrays, and external peripherals.
  • Compact, Surface-Mount Package: 256-FBGA (17×17) delivers a space-efficient footprint for PCB designs that require high pin density.
  • On-Device Clocking: Up to two PLLs enable local clock generation and phase management for synchronous designs.
  • Low-Voltage Core: Core supply range of 1.425–1.575 V supports modern low-voltage system architectures.
  • Commercial Availability: Commercial temperature grade and RoHS compliance make the device suitable for standard embedded and consumer electronics applications.

Why Choose EP1C6F256C7?

The EP1C6F256C7 delivers a practical combination of logic resources, embedded RAM, and extensive I/O in a compact 256-BGA package, making it a strong option for designers seeking to consolidate discrete logic and interface functions into a single configurable device. Its Cyclone family architecture provides on-device clocking and flexible I/O capability while operating within standard commercial voltage and temperature limits.

This device is well suited for development teams and OEMs building mid-range data-path, interface, or embedded control systems that require a programmable, low-voltage FPGA with a moderate logic and memory footprint and a high pin count in a surface-mount form factor.

Request a quote or submit a purchase inquiry to get pricing and availability for the EP1C6F256C7.

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