EP1C4F400I7N

The EP1C4F400I7N is a Cyclone® field-programmable gate array (FPGA) manufactured by Intel, delivered in a 400-ball FineLine BGA (21×21) package for surface-mount assembly. It provides a mid-range programmable fabric with 4,000 logic elements and on-chip RAM suitable for data-path, control, and custom-logic functions in industrial embedded designs.

Engineered for integration and temperature resilience, this device targets applications requiring substantial I/O (301 pins), embedded memory resources, and stable core power operation between 1.425 V and 1.575 V.

Key Features

• Logic Capacity — 4,000 logic elements for implementing mid-density logic, state machines, glue logic, and custom processing blocks.
• On‑Chip Memory — 78,336 total RAM bits (approximately 78.3 kbits) of embedded memory for FIFOs, small buffers, and register files.
• I/O Count — Up to 301 user I/O pins, enabling wide peripheral connectivity and parallel interfaces.
• Clocking Resources — Includes up to 2 PLLs as specified for the EP1C4 device family to support clock multiplication and phase adjustment.
• Power — Core supply range of 1.425 V to 1.575 V simplifies selection of a 1.5 V power rail for stable operation.
• Package & Mounting — 400-FBGA (21×21) surface-mount package (400-BGA case) for compact board integration.
• Operating Temperature — Industrial temperature grade: –40°C to 100°C suitable for harsh-environment deployment.
• Standards & Family Capabilities — As part of the Cyclone family, the device supports DDR memory interfaces and a variety of I/O standards, and is designed for data-path applications.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implements motor control logic, protocol bridging, and deterministic I/O handling across an extended temperature range.
• Data-Path & Memory Interfaces — Integrates control logic and buffering for DDR and external memory interfaces where embedded RAM and PLL-based clocking are needed.
• Communications & Interfaces — Supports designs requiring large I/O counts and diverse signaling standards for board-level protocol bridging and interface aggregation.
• Embedded System Glue Logic — Replaces multiple discrete components by consolidating custom control, timing, and peripheral interfacing into a single FPGA.

Unique Advantages

• Mid‑range Logic Density: 4,000 logic elements balance capacity and cost for many embedded and industrial designs.
• Significant On‑Chip Memory: 78,336 bits of RAM enable local buffering and small data-store functions without external memory.
• High I/O Count: 301 user I/O pins provide flexibility for parallel buses, multiple peripherals, and mixed-signal front ends.
• Industrial Temperature Rating: –40°C to 100°C supports deployment in demanding environmental conditions.
• Compact BGA Footprint: 400-FBGA (21×21) package reduces PCB area while maintaining robust pin count.
• Narrow Core Voltage Window: 1.425–1.575 V core supply simplifies power-rail design around a 1.5 V nominal rail.

Why Choose EP1C4F400I7N?

The EP1C4F400I7N offers a well-balanced combination of logic resources, embedded memory, and a high I/O count in a compact 400-FBGA package, making it suitable for industrial and data-path designs that require reliable operation from –40°C to 100°C. As a member of the Cyclone family from Intel, it leverages family-level features such as PLL-based clocking and documented migration paths across device densities.

This device is a practical choice for engineers seeking a mid-density FPGA that integrates necessary clocking and memory resources while maintaining a compact board footprint and RoHS compliance, providing long-term value for scalable embedded and industrial applications.

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