EP1C6F256C6

The EP1C6F256C6 is an Intel Cyclone® family SRAM-based FPGA provided in a 256-ball BGA package. It integrates approximately 5,980 logic elements and roughly 92 Kbits of embedded RAM across a compact surface-mount 256-FBGA (17×17) footprint, making it suitable for cost-sensitive data-path and embedded applications.

Designed for mainstream commercial applications, this Cyclone device targets use cases that require balanced logic density, on-chip memory, flexible I/O and low-voltage operation. The device supports family-level capabilities such as phase-locked loop (PLL) clocking resources and high-speed I/O standards described in the Cyclone device documentation.

Key Features

• Logic Capacity  Approximately 5,980 logic elements for implementing combinational and sequential logic.
• Embedded Memory  Approximately 92 Kbits of on-chip RAM to support buffering, FIFOs and small lookup tables.
• I/O Resources  185 user I/O pins to interface with external peripherals and memory devices.
• Clocking and Timing  Family documentation indicates support for PLL-based clocking; Cyclone devices provide up to two PLLs for clock multiplication and phase adjustment.
• Power Supply  Operates from a nominal supply range of 1.425 V to 1.575 V, suitable for 1.5-V system domains.
• Package and Mounting  256-ball FBGA (17×17) package, surface-mount; compact footprint for space-constrained PCBs.
• Operating Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards and Family Capabilities  Cyclone family documentation lists support for common I/O standards and high-speed LVDS interfaces (family-level feature).
• RoHS Compliance  This device is RoHS compliant.

Typical Applications

• Data-path acceleration  Implement custom arithmetic and data routing for applications that require moderate logic capacity and on-chip buffering.
• Memory-interface controllers  Use on-chip logic and embedded RAM to implement DDR/SDR memory interfaces and related control logic (family-level memory interface support referenced in the Cyclone documentation).
• High-speed I/O and communications  Leverage the device's I/O count and Cyclone family support for LVDS to implement serial links and board-level communication interfaces.
• Peripheral bridging and interface logic  Create custom bridges between legacy and modern peripherals or glue logic for system integration using the available I/O and logic resources.

Unique Advantages

• Balanced logic and memory  Approximately 5,980 logic elements paired with ~92 Kbits of embedded RAM provide a versatile platform for mixed-control and data buffering tasks.
• Compact BGA footprint  256-FBGA (17×17) package enables integration on space-constrained PCBs while preserving a high I/O count.
• Flexible I/O capacity  With 185 user I/O pins, the device supports multiple external interfaces without large I/O multiplexing schemes.
• Low-voltage operation  Designed for 1.425–1.575 V supply domains, aligning with 1.5-V system architectures.
• Commercial-temperature operation  Rated for 0 °C to 85 °C to meet mainstream embedded and consumer-level environmental requirements.
• Regulatory compliance  RoHS compliance simplifies selection for designs targeting controlled-substance requirements.

Why Choose EP1C6F256C6?

The EP1C6F256C6 positions itself as a cost-effective Cyclone family FPGA option for designers who need a practical balance of logic capacity, embedded RAM and extensive I/O in a compact surface-mount BGA package. Its nominal 1.5-V supply compatibility and family-level clocking and I/O capabilities make it a suitable choice for data-path processing, memory interface logic and mid-complexity system glue logic.

For teams developing commercial embedded or consumer devices, the EP1C6F256C6 offers predictable performance, a clear spec sheet for power and temperature, and RoHS compliance to streamline assembly and regulatory planning.

Request a quote or submit a quote for the EP1C6F256C6 to begin integration planning or to evaluate this device for your next FPGA-based design.