EP1C6F256C6N
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA |
|---|---|
| Quantity | 1,827 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 185 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 598 | Number of Logic Elements/Cells | 5980 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 92160 |
Overview of EP1C6F256C6N – Cyclone® FPGA, 5,980 Logic Elements, 92,160-bit On-Chip RAM, 256-BGA
The EP1C6F256C6N is a Cyclone® family SRAM-based field programmable gate array (FPGA) packaged in a 256-ball fine-pitch BGA. It integrates 5,980 logic elements and 92,160 bits of embedded RAM to address mid-density programmable logic needs.
Designed for data-path and interface-focused applications, this device offers a balance of logic, embedded memory, and I/O density suitable for communication, signal processing, and embedded control designs that require a commercial-grade FPGA solution.
Key Features
- Logic Resources — 5,980 logic elements delivering mid-range programmable logic capacity for implementing state machines, datapaths, and custom logic.
- Embedded Memory — 92,160 total on-chip RAM bits (approximately 92 Kbits) to support buffering, FIFOs, and small on-chip data storage needs.
- I/O Density — 185 user I/O pins to connect to peripherals, memory interfaces, and board-level signals.
- Clocking — Cyclone family architecture provides up to two phase-locked loops (PLLs) for clock multiplication and phase adjustment to support varied timing domains.
- Supply Voltage — Operates from 1.425 V to 1.575 V, compatible with the Cyclone family’s 1.5-V SRAM process.
- Package & Mounting — 256-ball FBGA in a 17 × 17 mm footprint, surface-mount package optimized for space-constrained board designs.
- Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Standards & Interfaces (series-level) — Cyclone family supports a variety of I/O standards and interfaces commonly used for high-speed serial and parallel data paths, memory interfaces, and ASIC/ASSP bridging.
- RoHS Compliance — Device is RoHS-compliant to meet regulatory and assembly requirements.
Typical Applications
- Data-Path Processing — Implement packet processing, protocol translation, or data framing logic using the device’s logic elements and on-chip RAM for buffering.
- Memory Interface Bridging — Support DDR SDRAM, FCRAM, and other external memory interface requirements using available clocking resources and embedded RAM for temporary storage.
- Peripheral and Bus Interfaces — Bridge or interface between ASSP/ASIC devices and system peripherals leveraging the device’s I/O count and family-level support for common I/O standards.
- Embedded Control and Signal Processing — Implement control logic, finite-state machines, and moderate-rate signal processing where mid-density logic and on-chip RAM suffice.
Unique Advantages
- Balanced Logic and Memory: 5,980 logic elements coupled with 92,160 bits of embedded RAM give designers the resources to implement control, datapath, and buffering in one device, reducing external memory needs.
- Flexible I/O Count: 185 user I/Os provide versatility for mixed-signal board designs and a variety of peripheral connections without immediate need for external switch matrices.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C, making it suitable for typical commercial and industrial-adjacent applications where commercial-grade devices are required.
- Compact Surface-Mount Package: 256-FBGA (17 × 17 mm) package supports high-density board layouts while maintaining manufacturability with standard surface-mount assembly.
- Series-Level Interface Support: Cyclone family features enable support for common high-speed I/O standards and memory interfaces, simplifying integration with existing system components.
- Regulatory Compliance: RoHS compliance helps streamline compliance for assembled products and reduces lead-content concerns in manufacturing.
Why Choose EP1C6F256C6N?
The EP1C6F256C6N positions itself as a mid-density Cyclone® FPGA option that combines a practical mix of logic elements, embedded RAM, and I/O density in a compact 256-BGA package. Its supply voltage range and family architecture make it suitable for designs that need reliable programmable logic, moderate on-chip memory, and flexible I/O in commercial-temperature environments.
This device is well suited for engineers developing data-path, interface, or control-focused systems who require a field-programmable solution with a mature family ecosystem and predictable, verifiable specifications for board-level integration.
Request a quote or submit an RFQ to obtain pricing and availability for the EP1C6F256C6N and support materials to help evaluate the device for your next design.

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