EP1C6F256C6N

IC FPGA 185 I/O 256FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA

Quantity 1,827 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs598Number of Logic Elements/Cells5980
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits92160

Overview of EP1C6F256C6N – Cyclone® FPGA, 5,980 Logic Elements, 92,160-bit On-Chip RAM, 256-BGA

The EP1C6F256C6N is a Cyclone® family SRAM-based field programmable gate array (FPGA) packaged in a 256-ball fine-pitch BGA. It integrates 5,980 logic elements and 92,160 bits of embedded RAM to address mid-density programmable logic needs.

Designed for data-path and interface-focused applications, this device offers a balance of logic, embedded memory, and I/O density suitable for communication, signal processing, and embedded control designs that require a commercial-grade FPGA solution.

Key Features

  • Logic Resources — 5,980 logic elements delivering mid-range programmable logic capacity for implementing state machines, datapaths, and custom logic.
  • Embedded Memory — 92,160 total on-chip RAM bits (approximately 92 Kbits) to support buffering, FIFOs, and small on-chip data storage needs.
  • I/O Density — 185 user I/O pins to connect to peripherals, memory interfaces, and board-level signals.
  • Clocking — Cyclone family architecture provides up to two phase-locked loops (PLLs) for clock multiplication and phase adjustment to support varied timing domains.
  • Supply Voltage — Operates from 1.425 V to 1.575 V, compatible with the Cyclone family’s 1.5-V SRAM process.
  • Package & Mounting — 256-ball FBGA in a 17 × 17 mm footprint, surface-mount package optimized for space-constrained board designs.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Standards & Interfaces (series-level) — Cyclone family supports a variety of I/O standards and interfaces commonly used for high-speed serial and parallel data paths, memory interfaces, and ASIC/ASSP bridging.
  • RoHS Compliance — Device is RoHS-compliant to meet regulatory and assembly requirements.

Typical Applications

  • Data-Path Processing — Implement packet processing, protocol translation, or data framing logic using the device’s logic elements and on-chip RAM for buffering.
  • Memory Interface Bridging — Support DDR SDRAM, FCRAM, and other external memory interface requirements using available clocking resources and embedded RAM for temporary storage.
  • Peripheral and Bus Interfaces — Bridge or interface between ASSP/ASIC devices and system peripherals leveraging the device’s I/O count and family-level support for common I/O standards.
  • Embedded Control and Signal Processing — Implement control logic, finite-state machines, and moderate-rate signal processing where mid-density logic and on-chip RAM suffice.

Unique Advantages

  • Balanced Logic and Memory: 5,980 logic elements coupled with 92,160 bits of embedded RAM give designers the resources to implement control, datapath, and buffering in one device, reducing external memory needs.
  • Flexible I/O Count: 185 user I/Os provide versatility for mixed-signal board designs and a variety of peripheral connections without immediate need for external switch matrices.
  • Commercial Temperature Suitability: Rated for 0 °C to 85 °C, making it suitable for typical commercial and industrial-adjacent applications where commercial-grade devices are required.
  • Compact Surface-Mount Package: 256-FBGA (17 × 17 mm) package supports high-density board layouts while maintaining manufacturability with standard surface-mount assembly.
  • Series-Level Interface Support: Cyclone family features enable support for common high-speed I/O standards and memory interfaces, simplifying integration with existing system components.
  • Regulatory Compliance: RoHS compliance helps streamline compliance for assembled products and reduces lead-content concerns in manufacturing.

Why Choose EP1C6F256C6N?

The EP1C6F256C6N positions itself as a mid-density Cyclone® FPGA option that combines a practical mix of logic elements, embedded RAM, and I/O density in a compact 256-BGA package. Its supply voltage range and family architecture make it suitable for designs that need reliable programmable logic, moderate on-chip memory, and flexible I/O in commercial-temperature environments.

This device is well suited for engineers developing data-path, interface, or control-focused systems who require a field-programmable solution with a mature family ecosystem and predictable, verifiable specifications for board-level integration.

Request a quote or submit an RFQ to obtain pricing and availability for the EP1C6F256C6N and support materials to help evaluate the device for your next design.

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