EP1C6F256C8EC
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA |
|---|---|
| Quantity | 924 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 185 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 598 | Number of Logic Elements/Cells | 5980 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 92160 |
Overview of EP1C6F256C8EC – Cyclone® FPGA, 5,980 logic elements, 92,160-bit RAM, 185 I/O, 256-BGA
The EP1C6F256C8EC is a Cyclone® family field programmable gate array (FPGA) in a 256-BGA (256-FBGA 17×17) package intended for commercial applications. It combines a moderate logic capacity with embedded RAM and flexible I/O to address data-path functions, memory interfacing, and general-purpose programmable logic tasks.
This device is optimized for designs requiring 5,980 logic elements, up to two PLLs for clocking, and 185 user I/O pins, while operating within a 1.425 V to 1.575 V supply range and a commercial temperature window of 0 °C to 85 °C.
Key Features
- Core Logic 5,980 logic elements (LEs) provide the combinational and sequential resources for custom logic implementation.
- Embedded Memory Approximately 0.092 Mbits of on-chip RAM (92,160 total RAM bits), arranged in the family’s M4K RAM block architecture.
- I/O Capacity 185 user I/O pins support a wide range of external interfaces and peripheral connections.
- Clocking Up to two PLLs per device and multiple global clock resources support flexible clock management and phase shifting for data-path applications.
- I/O Standards Family-level support for LVDS, LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards for compatibility with diverse signaling requirements.
- Package & Mounting Supplied in a 256-BGA (256-FBGA 17×17) package, designed for surface-mount assembly.
- Power & Operating Range Nominal supply window of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
- Compliance RoHS-compliant construction for environmental regulatory alignment.
Typical Applications
- Data-path processing Implement custom data-path pipelines and buffering using the device’s logic elements and embedded RAM.
- Memory interface controllers Use the device’s memory blocks and clocking resources to build DDR/SDR memory controllers and related interfaces.
- High-speed I/O bridging Leverage LVDS and other supported I/O standards to interface between high-speed serial/parallel peripherals and system logic.
- Peripheral & bus control Implement custom bus logic, glue logic, and peripheral controllers using available I/O and programmable logic.
Unique Advantages
- Balanced logic and memory ratio: 5,980 logic elements paired with 92,160 bits of embedded RAM enable compact implementations of moderate-complexity datapaths and controllers.
- Flexible clocking: Two on-chip PLLs and multiple global clock lines provide the timing control needed for synchronous interfaces and phase-sensitive designs.
- Generous I/O count: 185 user I/O pins support rich external connectivity without requiring external multiplexing or port extenders.
- Surface-mount BGA packaging: 256-FBGA (17×17) package supports space-efficient board layouts common in compact systems.
- Commercial temperature and supply compatibility: Operates across a 1.425 V–1.575 V supply window and 0 °C–85 °C temperature range for standard commercial deployments.
- RoHS compliant: Meets lead-free regulatory requirements for modern manufacturing processes.
Why Choose EP1C6F256C8EC?
The EP1C6F256C8EC positions itself as a flexible Cyclone® FPGA option for commercial designs that need a mid-range logic count with integrated RAM and a substantial I/O complement. Its combination of 5,980 logic elements, approximately 0.092 Mbits of embedded memory, two PLLs, and 185 I/O pins makes it suitable for implementers building memory interfaces, data-path logic, and custom peripheral controllers.
For engineering teams seeking a programmable solution with clear supply and temperature requirements, a compact 256-BGA footprint for surface-mount assembly, and RoHS compliance, this device provides a balanced platform that aligns with standard procurement and integration processes.
Request a quote or submit an inquiry to receive pricing and availability for EP1C6F256C8EC and to discuss how this Cyclone® FPGA fits your design requirements.

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