EP1C6F256C8EC

IC FPGA 185 I/O 256FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 92160 5980 256-BGA

Quantity 924 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs598Number of Logic Elements/Cells5980
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits92160

Overview of EP1C6F256C8EC – Cyclone® FPGA, 5,980 logic elements, 92,160-bit RAM, 185 I/O, 256-BGA

The EP1C6F256C8EC is a Cyclone® family field programmable gate array (FPGA) in a 256-BGA (256-FBGA 17×17) package intended for commercial applications. It combines a moderate logic capacity with embedded RAM and flexible I/O to address data-path functions, memory interfacing, and general-purpose programmable logic tasks.

This device is optimized for designs requiring 5,980 logic elements, up to two PLLs for clocking, and 185 user I/O pins, while operating within a 1.425 V to 1.575 V supply range and a commercial temperature window of 0 °C to 85 °C.

Key Features

  • Core Logic  5,980 logic elements (LEs) provide the combinational and sequential resources for custom logic implementation.
  • Embedded Memory  Approximately 0.092 Mbits of on-chip RAM (92,160 total RAM bits), arranged in the family’s M4K RAM block architecture.
  • I/O Capacity  185 user I/O pins support a wide range of external interfaces and peripheral connections.
  • Clocking  Up to two PLLs per device and multiple global clock resources support flexible clock management and phase shifting for data-path applications.
  • I/O Standards  Family-level support for LVDS, LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards for compatibility with diverse signaling requirements.
  • Package & Mounting  Supplied in a 256-BGA (256-FBGA 17×17) package, designed for surface-mount assembly.
  • Power & Operating Range  Nominal supply window of 1.425 V to 1.575 V and commercial operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS-compliant construction for environmental regulatory alignment.

Typical Applications

  • Data-path processing  Implement custom data-path pipelines and buffering using the device’s logic elements and embedded RAM.
  • Memory interface controllers  Use the device’s memory blocks and clocking resources to build DDR/SDR memory controllers and related interfaces.
  • High-speed I/O bridging  Leverage LVDS and other supported I/O standards to interface between high-speed serial/parallel peripherals and system logic.
  • Peripheral & bus control  Implement custom bus logic, glue logic, and peripheral controllers using available I/O and programmable logic.

Unique Advantages

  • Balanced logic and memory ratio: 5,980 logic elements paired with 92,160 bits of embedded RAM enable compact implementations of moderate-complexity datapaths and controllers.
  • Flexible clocking: Two on-chip PLLs and multiple global clock lines provide the timing control needed for synchronous interfaces and phase-sensitive designs.
  • Generous I/O count: 185 user I/O pins support rich external connectivity without requiring external multiplexing or port extenders.
  • Surface-mount BGA packaging: 256-FBGA (17×17) package supports space-efficient board layouts common in compact systems.
  • Commercial temperature and supply compatibility: Operates across a 1.425 V–1.575 V supply window and 0 °C–85 °C temperature range for standard commercial deployments.
  • RoHS compliant: Meets lead-free regulatory requirements for modern manufacturing processes.

Why Choose EP1C6F256C8EC?

The EP1C6F256C8EC positions itself as a flexible Cyclone® FPGA option for commercial designs that need a mid-range logic count with integrated RAM and a substantial I/O complement. Its combination of 5,980 logic elements, approximately 0.092 Mbits of embedded memory, two PLLs, and 185 I/O pins makes it suitable for implementers building memory interfaces, data-path logic, and custom peripheral controllers.

For engineering teams seeking a programmable solution with clear supply and temperature requirements, a compact 256-BGA footprint for surface-mount assembly, and RoHS compliance, this device provides a balanced platform that aligns with standard procurement and integration processes.

Request a quote or submit an inquiry to receive pricing and availability for EP1C6F256C8EC and to discuss how this Cyclone® FPGA fits your design requirements.

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