EP1K30TC144-3

The EP1K30TC144-3 is an Intel ACEX-1K family FPGA offering a balanced mid-range programmable logic resource set for cost-sensitive, high-volume designs. Built around a logic array with embedded array blocks (EABs), it provides 1,728 logic elements, 24,576 bits of embedded RAM and 102 user I/O pins in a surface-mount 144‑LQFP package.

This device is targeted at applications that require system-on-a-programmable-chip integration, flexible I/O interfacing and on-chip memory for glue logic, peripheral interfaces and compact SOPC-style implementations while operating within commercial temperature and supply ranges.

Key Features

• Logic Capacity — 1,728 logic elements providing programmable resources for combinational and sequential logic; family maximum system gates for this device class is listed as 119,000.
• Embedded Memory (EABs) — 24,576 bits of on-chip RAM implemented via EABs (dual-port capable as described for the family), enabling efficient storage and small FIFO or buffer implementations.
• I/O and Voltage — 102 user I/O pins with MultiVolt I/O capability across the ACEX‑1K family; device operates with a specified supply range of 2.375 V to 2.625 V and an internal 2.5‑V supply.
• Package & Mounting — Surface-mount 144‑LQFP package (supplier device package: 144‑TQFP, 20 × 20 mm) for compact board-level integration.
• Operating Conditions & Grade — Commercial grade device with an operating temperature range of 0 °C to 70 °C.
• System Features — Family-level features include JTAG boundary-scan (IEEE 1149.1) for in-system test, in-circuit reconfigurability options, and low-skew clock distribution with ClockLock/ClockBoost options described for ACEX‑1K devices.
• Interconnect & Arithmetic Support — Dedicated carry and cascade chains and FastTrack interconnect within the family to implement fast adders, counters and high‑fan‑in logic structures efficiently.
• Performance & Bus Compliance — ACEX‑1K family documentation lists bidirectional I/O performance suitable for high-speed interfaces and compliance with PCI Local Bus Specification Revision 2.2 for 3.3‑V operation at 33 MHz or 66 MHz.
• Design & Tool Support — The ACEX‑1K family is supported by vendor development systems and common EDA flows (VHDL, Verilog, LPM, EDIF) for design entry, synthesis and place-and-route as described in the series documentation.
• Environmental — RoHS compliant.

Typical Applications

• Communications interfaces — Implement protocol glue logic, buffering and timing-critical interface functions using the on-chip RAM and dedicated carry/cascade resources.
• Embedded system glue logic — Replace discrete glue chips with a single programmable device to manage bus interfacing, address decoding and peripheral control.
• Peripheral and I/O control — Use the 102 I/O pins and programmable I/O features to interface with 2.5 V/3.3 V/5.0 V devices (per family capabilities) for board-level peripheral integration.
• Low-cost SOPC implementations — Leverage embedded RAM and logic resources for compact system-on-programmable-chip designs in volume applications.

Unique Advantages

• Balanced mid-range resources: 1,728 logic elements with 24,576 bits of embedded RAM provide a compact but capable platform for moderate-complexity designs without excess cost.
• Flexible I/O strategy: 102 I/O pins and family MultiVolt I/O capability simplify interfacing to mixed-voltage peripherals and legacy logic families.
• Compact package: The 144‑LQFP surface-mount package offers a small board footprint and straightforward routing for cost-sensitive, space-constrained designs.
• Design ecosystem support: Family-level toolchain and netlist/LPM support streamline design entry, synthesis and implementation for faster time to prototype.
• On-board testability: Built-in JTAG boundary-scan support enables in-system testing and programming without consuming additional logic.
• RoHS compliant: Meets common lead-free requirements for modern manufacturing processes.

Why Choose EP1K30TC144-3?

The EP1K30TC144-3 delivers a practical balance of logic, embedded memory and I/O in a commercial-temperature, surface-mount 144‑LQFP package. It is positioned for designers who need moderate programmable logic capacity (1,728 logic elements), on-chip RAM (24,576 bits) and flexible I/O to implement compact SOPC-style and interface-driven designs while keeping BOM and board area under control.

Backed by ACEX‑1K family documentation and tool support, this device is suited to teams focused on cost-efficient, high-volume deployments that require reliable reconfigurability, JTAG-based testability and established design flows.

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