EP1K30TC144-2N

IC FPGA 102 I/O 144TQFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 102 24576 1728 144-LQFP

Quantity 1,748 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EP1K30TC144-2N – ACEX-1K® Field Programmable Gate Array (FPGA), 1,728 logic elements, 24,576-bit RAM, 144-LQFP

The EP1K30TC144-2N is an Intel ACEX-1K family FPGA delivering a mid-density programmable logic platform with 1,728 logic elements and 24,576 bits of embedded RAM. Designed for commercial applications, it provides a compact, reconfigurable solution for system-on-a-programmable-chip (SOPC) integration, embedded memory functions and general-purpose logic implementation.

With 102 user I/O pins, a 144-pin LQFP surface-mount package, and an internal 2.5 V supply operating within an external 2.375 V to 2.625 V range, this device balances integration and board-level flexibility for volume designs that require embedded memory and predictable I/O behavior.

Key Features

  • Core logic  1,728 logic elements (LEs) providing arrayed resources for combinational and sequential logic; device-level capacity corresponds to up to 119,000 system gates.
  • Embedded memory  Approximately 24,576 bits of on-chip RAM implemented across embedded array blocks (EABs) suitable for dual-port memory and buffering functions.
  • I/O and voltage support  102 user I/O pins and MultiVolt I/O capability from the ACEX-1K family; the device operates with an internal 2.5 V supply and an external voltage supply range of 2.375 V to 2.625 V.
  • Package and mounting  144-pin LQFP package in a surface-mount form factor; supplier package listed as 144-TQFP (20×20 mm) for PCB footprint planning.
  • Configuration and test  In-circuit reconfigurability and built-in JTAG boundary-scan test (BST) support for board-level programming and test without consuming user logic.
  • Clocking and interconnect  Family-level features include low-skew clock distribution, options for clock delay/boost, and a predictable FastTrack interconnect structure for reliable timing behavior.
  • Arithmetic and logic primitives  Dedicated carry and cascade chains accelerate arithmetic functions, adders and high-fan-in logic implementations.
  • Regulatory and grade  RoHS compliant and specified for commercial operating temperatures from 0 °C to 70 °C.

Typical Applications

  • System-on-a-board integration  Programmable SOPC glue logic and peripheral integration where embedded RAM and moderate logic capacity streamline board-level functions.
  • Communications and protocol bridging  Custom protocol interfacing, buffering and control logic in communications products that benefit from on-chip memory and reconfigurable logic.
  • Embedded memory and buffering  Dual-port memory emulation, FIFOs and temporary data storage using the device’s embedded RAM blocks for local buffering needs.
  • Mixed-voltage I/O interfacing  I/O tasks that require flexible signaling levels and programmable output behavior in mixed-voltage environments.

Unique Advantages

  • Balanced integration of logic and memory:  1,728 logic elements paired with 24,576 bits of embedded RAM provide a compact platform for combining control logic and local data storage on a single device.
  • Flexible I/O and voltage handling:  102 user I/O pins and family MultiVolt I/O capability enable interfacing with multiple device voltage domains while using a 2.5 V internal core.
  • Board-level test and reconfiguration:  Built-in JTAG boundary-scan and in-circuit reconfigurability simplify production test flows and field updates without consuming user logic resources.
  • Predictable timing and arithmetic support:  Low-skew clock networks, dedicated carry/cascade chains and FastTrack interconnects help realize efficient arithmetic and timing-critical functions.
  • Compact surface-mount package:  144-LQFP (surface mount) footprint supports high-density board designs while maintaining accessible I/O for routing and prototyping.
  • RoHS-compliant commercial solution:  Suited for volume commercial designs with documented temperature and supply ranges (0 °C to 70 °C; 2.375 V–2.625 V).

Why Choose EP1K30TC144-2N?

The EP1K30TC144-2N offers a pragmatic balance of logic density, embedded memory and I/O flexibility for commercial designs that need on-chip RAM and reconfigurable logic without the overhead of larger devices. Its ACEX-1K family features—such as predictable interconnect, dedicated arithmetic chains and in-circuit reconfigurability—make it well suited to SOPC integration, protocol bridging and embedded buffering roles.

Choose this device when you require a RoHS-compliant, surface-mount FPGA with defined commercial temperature and supply ranges, straightforward board-level testability via JTAG, and the integration advantages of combined logic and embedded memory resources.

Request a quote or submit your procurement inquiry to evaluate EP1K30TC144-2N for your next design. Our team can provide pricing and availability information tailored to your project needs.

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