EP1K30QI208-2

IC FPGA 147 I/O 208QFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

Quantity 1,324 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EP1K30QI208-2 – ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

The EP1K30QI208-2 is an ACEX-1K family FPGA from Intel designed for system-on-a-programmable-chip (SOPC) integration. It combines mid-density programmable logic with embedded memory and flexible I/O to support functions such as on-chip memory, specialized logic, and dual-port embedded-array implementations.

Targeted at industrial and communications-oriented designs, this device delivers a balance of logic capacity, on-chip RAM, and I/O count in a compact surface-mount package for volume-focused and cost-sensitive applications.

Key Features

  • Core Logic — Approximately 1,728 logic elements providing a programmable fabric sized for mid-density logic integration; device listing shows up to 119,000 system gates.
  • Embedded Memory (EABs) — Total on-chip RAM of 24,576 bits with embedded array blocks (EABs) and dual-port capability to support efficient on-chip storage and megafunctions.
  • I/O Flexibility — 147 user I/O pins with MultiVolt I/O capability (I/O can drive or be driven by 2.5-V, 3.3-V, or 5.0-V devices according to the device family specification) and programmable output options for interface adaptability.
  • Supply and Operating Range — Operates with a 2.5-V internal supply and a specified voltage-supply range of 2.375 V to 2.625 V; rated for industrial operating temperatures from 0 °C to 70 °C.
  • Configuration and Test — Built-in JTAG boundary-scan (IEEE 1149.1) for board test and support for in-circuit reconfigurability via external configuration devices or the JTAG port.
  • Clocking and Timing — Built-in low-skew clock distribution trees with multiple global clocks and options such as ClockLock and ClockBoost for reduced clock delay and skew (family-level features).
  • Interconnect and Arithmetic — FastTrack interconnect architecture with dedicated carry and cascade chains to implement arithmetic and high-fan-in logic functions efficiently.
  • Package and Mounting — Surface-mount 208-pin BFQFP package (supplier package: 208-PQFP 28×28) for compact board integration.

Typical Applications

  • Embedded Systems / SOPC Integration — Implement memory-backed megafunctions and custom logic for system integration on a single programmable device.
  • Communications Equipment — Mid-density logic and embedded RAM support protocol processing and buffering demands in communications modules.
  • Industrial Control — Programmable control, I/O interfacing, and local data buffering in industrial automation applications within the specified operating temperature range.
  • Cost-Sensitive High-Volume Designs — Cost-optimized programmable architecture suitable for designs where integration and unit-cost are primary considerations.

Unique Advantages

  • Balanced Integration: Combines 1,728 logic elements with 24,576 bits of on-chip RAM to reduce external component count and simplify board-level memory requirements.
  • Flexible Interfacing: A large complement of 147 I/O pins with family-level MultiVolt I/O support simplifies interfacing to a variety of voltage domains.
  • Deterministic Clocking: Low-skew clock distribution and multiple global clocks with ClockLock/ClockBoost options support predictable timing in synchronous designs.
  • Test and Reconfiguration: Integrated JTAG boundary-scan and in-circuit reconfigurability enable board-level testability and field updates without additional logic consumption.
  • Board-Level Friendly Package: 208-pin BFQFP surface-mount package (208-PQFP, 28×28) fits compact PCB layouts while preserving ample I/O.
  • Industrial-Rated Operation: Supplied in an industrial grade variant with an operating range of 0 °C to 70 °C and defined supply voltage window for predictable deployment.

Why Choose EP1K30QI208-2?

The EP1K30QI208-2 delivers a mid-density ACEX-1K FPGA option that balances programmable logic capacity, embedded RAM, and I/O count in a compact surface-mount package. Its combination of approximately 1,728 logic elements, 24,576 bits of on-chip memory, and 147 user I/Os makes it well suited to SOPC integration, communications subsystems, and industrial control applications where integration and predictable behavior matter.

Supported by the ACEX-1K family feature set—on-chip EABs, JTAG boundary-scan, flexible clocking, and software design support from family development tools—this device provides a pragmatic, cost-conscious path to implement custom logic and embedded functions in volume designs.

Request a quote or submit an inquiry for pricing and availability of EP1K30QI208-2 to evaluate fit for your next design.

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