EP1K30TC144-1

IC FPGA 102 I/O 144TQFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 102 24576 1728 144-LQFP

Quantity 90 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 70°C
Package / Case144-LQFPNumber of I/O102Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EP1K30TC144-1 – ACEX-1K FPGA, 1,728 logic elements, 24,576-bit embedded RAM, 102 I/Os, 144-LQFP

The EP1K30TC144-1 is an ACEX-1K family field programmable gate array (FPGA) from Intel, offering a compact, cost-efficient programmable logic solution in a 144-LQFP surface-mount package. It combines a 1,728‑logic‑element fabric with approximately 24,576 bits of embedded RAM and 102 user I/O pins, positioning it for system-on-a-programmable-chip (SOPC) integration and high-volume communications or control applications that require flexible I/O and embedded memory.

Key Features

  • Core Logic — 1,728 logic elements providing combinational and registered logic for glue logic, control, and custom functions; equivalent to 119,000 maximum system gates for complex designs.
  • Embedded Memory (EABs) — Approximately 24,576 bits of on-chip RAM organized in embedded array blocks suitable for FIFOs, small buffers, and storage of state data.
  • I/O Capability — 102 user I/O pins in a 144‑lead LQFP package with MultiVolt I/O support for mixed-voltage interfacing (family feature), enabling direct interfacing to different logic levels.
  • Package & Mounting — 144‑LQFP surface‑mount package (supplier device package listed as 144‑TQFP 20×20), enabling compact board layouts and automated assembly.
  • Power & Voltage — Device operates with an internal 2.5‑V supply and a specified external supply range of 2.375 V to 2.625 V, supporting efficient power delivery for embedded applications.
  • Operating Range — Commercial temperature grade with an operating range of 0 °C to 70 °C, suitable for a wide range of consumer and commercial electronic products.
  • Clocking & Performance — Family features include built-in low‑skew clock distribution, options for reduced clock delay and skew, and bidirectional I/O performance up to 250 MHz (per family datasheet).
  • Configuration & Test — In‑circuit reconfigurability via external configuration devices, intelligent controllers, or JTAG; includes IEEE 1149.1 (JTAG) boundary-scan support for board-level test.
  • Compliance & Environmental — RoHS compliant; family-level features include PCI Local Bus Specification compatibility for -1 speed grade devices (as documented in the ACEX-1K datasheet).

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) — Integrate control logic, glue logic, and small embedded functions into a single device to reduce bill of materials and board complexity.
  • Communications Interfaces — Implement protocol bridging, buffering, and custom I/O handling where embedded RAM and multiple I/O standards are needed.
  • Embedded Control — Use as a programmable controller for motor drives, sensor aggregation, or custom state machines in commercial equipment.
  • Prototyping and Logic Acceleration — Rapidly prototype custom digital blocks and offload timing-critical functions from microcontrollers or DSPs.

Unique Advantages

  • Balanced integration: Combines 1,728 logic elements with embedded RAM to consolidate discrete logic and small memory functions into one package, reducing component count.
  • Flexible I/O: 102 user I/Os and family support for multi-voltage signaling simplify interfacing with diverse peripherals and legacy logic levels.
  • Compact package: 144‑lead LQFP surface‑mount packaging offers a compact footprint for space‑constrained boards while supporting automated assembly.
  • Design and test support: Built‑in JTAG boundary-scan and support for in‑circuit reconfigurability streamline board bring‑up and manufacturing test flows.
  • Predictable timing infrastructure: Low‑skew clock trees and dedicated carry/cascade chains (family features) enable more efficient implementation of arithmetic and high‑fan‑in logic.
  • Regulated supply range: Narrow external supply window (2.375–2.625 V) and 2.5‑V internal supply simplify power‑supply design and decoupling strategies.

Why Choose EP1K30TC144-1?

The EP1K30TC144-1 is positioned as a cost-effective, compact FPGA for designers needing a blend of logic density, embedded memory, and flexible I/O in a commercial temperature grade. Its 1,728 logic elements and approximately 24,576 bits of embedded RAM allow efficient implementation of SOPC-style functions, buffering, and custom interfaces without large, power-hungry devices.

Backed by the ACEX-1K family design ecosystem and built‑in configuration and test features, this device suits engineering teams targeting high-volume or space-constrained applications that require reliable, reconfigurable logic with a clear upgrade path within the ACEX-1K family.

Request a quote or submit an inquiry to receive pricing and availability information for the EP1K30TC144-1.

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