EP1K30QC208-2N

IC FPGA 147 I/O 208QFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

Quantity 443 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EP1K30QC208-2N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

The EP1K30QC208-2N is an ACEX-1K family field programmable gate array (FPGA) optimized for cost-sensitive system integration. It combines a logic array with enhanced embedded array blocks (EABs) to implement memory and specialized logic functions within a single programmable device.

Targeted at commercial applications, the device provides a balance of logic capacity, on-chip memory, and I/O density for designs that require in-system reconfigurability, embedded memory blocks, and predictable interfacing in a 208-pin BFQFP package.

Key Features

  • Logic Capacity — Provides 1,728 logic elements for implementing combinational and sequential logic functions; specified as approximately 119,000 system gates.
  • Embedded Memory (EABs) — Enhanced embedded array blocks support megafunctions and efficient memory implementation, with a total of approximately 24,576 bits of on-chip RAM and dual-port capability per EAB (up to 16-bit width).
  • I/O and Voltage — 147 user I/O pins with flexible I/O options; device operates with a supply range of 2.375 V to 2.625 V and an internal 2.5-V supply architecture as described in the family specification.
  • Packaging and Mounting — Supplied in a 208-BFQFP (208-PQFP 28×28) package, designed for surface-mount assembly in standard commercial production flows.
  • System Features — Supports in-circuit reconfigurability and includes JTAG boundary-scan test (IEEE Std. 1149.1) for board-level test and configuration without consuming user logic.
  • Design & Test Support — The ACEX 1K family provides software design support and automatic place-and-route tools (per family documentation) along with 100% functional device testing.
  • Compliance & Environment — Commercial-grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance for lead-free manufacturing requirements.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) Integration — Consolidate glue logic, custom peripherals, and memory functions into a single device to reduce board count and simplify routing.
  • Communications and Interface Logic — Implement protocol glue, buffering, and custom packet processing using the device’s embedded memory and logic resources for mid-density communications designs.
  • Peripheral and Bus Bridging — Use on-chip EABs and plentiful I/O to adapt voltage domains and implement bus interface logic in compact commercial products.
  • Prototyping and In-Circuit Reconfiguration — Leverage in-circuit reconfigurability and JTAG support for iterative development and field updates in commercial electronic products.

Unique Advantages

  • Balanced Logic and Memory: 1,728 logic elements combined with approximately 24,576 bits of embedded RAM enables implementation of moderate-complexity logic plus localized data storage without external memory.
  • Flexible I/O Count: 147 user I/Os support multiple parallel interfaces and signal routing choices for system designers.
  • Compact, Surface-Mount Package: The 208-BFQFP package offers a standardized, board-friendly form factor for commercial assemblies.
  • Built-in Test and Reconfiguration: JTAG boundary-scan and in-circuit reconfigurability simplify production test, debugging, and field upgrades.
  • Commercial Temperature and RoHS Compliance: Rated for 0 °C to 70 °C operation and RoHS compliant to meet common commercial product requirements.
  • Toolchain and Family Support: Family-level design tools and automatic place-and-route support streamline development and migration within the ACEX-1K family.

Why Choose EP1K30QC208-2N?

The EP1K30QC208-2N positions itself as a cost-effective, mid-density FPGA for commercial applications that need a mix of programmable logic, embedded RAM, and flexible I/O in a compact 208-pin package. Its combination of 1,728 logic elements, approximately 24,576 bits of on-chip RAM, and 147 user I/Os makes it suitable for designs that require local memory and interface logic without adding external components.

Designers building mid-range communications, interface, or SOPC-style systems will find the device’s in-circuit reconfigurability, JTAG test support, and family-level software tools useful for reducing development time and simplifying production testing.

Request a quote or submit a procurement inquiry to receive pricing and availability information for EP1K30QC208-2N. Our team can provide lead-time details and support for volume requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up