EP1K30QC208-1N

IC FPGA 147 I/O 208QFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

Quantity 1,497 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs216Number of Logic Elements/Cells1728
Number of Gates119000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits24576

Overview of EP1K30QC208-1N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 24576 1728 208-BFQFP

The EP1K30QC208-1N is an ACEX-1K family programmable logic device (FPGA) delivering medium-density logic integration for embedded and communications-oriented designs. The device combines 1,728 logic elements with approximately 24,576 bits of embedded RAM and up to 147 user I/O pins in a compact 208-pin PQFP surface-mount package.

Designed for commercial-grade systems, this ACEX-1K device targets system-on-a-programmable-chip (SOPC) integration and cost-sensitive, high-density logic applications that require flexible I/O, embedded memory, and in-system reconfigurability.

Key Features

  • Core Logic — 1,728 logic elements (LEs) providing up to 119,000 system gates for medium-density designs.
  • Embedded Memory — Approximately 24,576 total RAM bits implemented across embedded array blocks (EABs); EABs support dual-port operation with up to 16-bit width per block.
  • I/O Flexibility — 147 user I/O pins with MultiVolt I/O capability to interface with 2.5 V, 3.3 V, or 5.0 V devices; per-pin features include individual tri-state enable, open-drain option, programmable slew-rate, and clamp-to-VCCIO selection.
  • System and Clocking — Dedicated carry and cascade chains, FastTrack interconnect for predictable routing, built-in low-skew clock distribution, and support for up to six global clock signals and four global clear signals.
  • Configuration and Test — Built-in JTAG boundary-scan test (IEEE 1149.1) and support for in-circuit reconfigurability via external configuration devices or JTAG.
  • Power and Temperature — Device operates with a 2.5 V internal supply and requires an external supply between 2.375 V and 2.625 V; commercial operating temperature range 0 °C to 70 °C.
  • Package and Mounting — 208-BFQFP package (supplier device package 208-PQFP, 28×28 mm) for surface-mount PCB assembly.
  • Environmental — RoHS compliant.

Typical Applications

  • System-on-a-Programmable-Chip (SOPC) — Integrate memory, specialized logic, and glue logic into a single device to reduce BOM and board area in embedded systems.
  • Communications Equipment — Implement medium-density protocol engines, buffering, and packet-processing logic using on-chip RAM and dedicated carry/cascade chains.
  • Peripheral and Interface Control — Use the device’s MultiVolt I/O and per-pin controls to bridge diverse voltage domains and implement custom I/O logic and bus interfaces.

Unique Advantages

  • Balanced integration: 1,728 logic elements combined with ~24,576 bits of embedded RAM enable compact implementations of control and data-path functions without external memory for many designs.
  • Flexible I/O with per-pin control: 147 I/Os with MultiVolt support and programmable slew-rate simplify mixed-voltage interfacing and signal integrity tuning on a per-pin basis.
  • Designer-friendly clocking and arithmetic support: Dedicated carry and cascade chains plus multiple global clocks streamline implementation of fast adders, counters, and high-fan-in logic.
  • On-board test and reconfiguration: Built-in JTAG boundary-scan and in-circuit reconfigurability allow streamlined board bring-up and field updates.
  • Compact, surface-mount package: 208-pin PQFP package offers a balance of pin count and manufacturability for space-constrained PCBs.
  • Regulatory readiness: RoHS compliance supports lead-free manufacturing flows.

Why Choose EP1K30QC208-1N?

The EP1K30QC208-1N is positioned for designers who need medium-density FPGA capability with embedded RAM, flexible I/O, and built-in configuration/test features in a commercial-grade, surface-mount package. Its combination of logic elements, on-chip memory, and I/O feature set makes it well suited for SOPC integration, communications logic, and peripheral/interface control where board-level integration and reconfigurability reduce overall system cost.

Selecting this ACEX-1K device provides a pragmatic balance of density, I/O flexibility, and system-level features—backed by the ACEX family architecture—to support scalable designs and straightforward development workflows.

Request a quote or submit an inquiry to get pricing and availability for EP1K30QC208-1N and to discuss volume options or lead times.

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